用于缩放DRAM的增强核心电路:0.7V VCC,在125°C下保持138ms,随机行/列访问时间加速1.5ns

Nicky Lu, C. Shiah, Juang-Ying Chueh, B. Rong, Wei-Jr Huang, Ho-Yin Chen, Cheng-Nan Chang, C. Chang, Tzung-Shen Chen
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引用次数: 0

摘要

两项发明改进了1Gb DDR3产品内的DRAM核心电路:(1)将VCC降至0.7V,但在存储单元中产生1.3V的Restore ONE信号,以在125°C下将保留时间至少提高到138ms。这有助于扩展VDD和外围设备。(2)当地址在DRAM控制器中准备好时,接口电路可以在其他命令之前将行/列地址预解码到DRAM中,从而使随机访问行/列时间分别加快1.5ns。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Enhanced Core Circuits for scaling DRAM: 0.7V VCC with Long Retention 138ms at 125°C and Random Row/Column Access Times Accelerated by 1.5ns
Two inventions improve DRAM’s core circuits within a 1Gb DDR3 product: (1) Scale VCC down to 0.7V but generate a Restore ONE signal 1.3V into memory cells to enhance Retention-Time at least to 138ms at 125°C. This facilitates scaling VDD and peripheral devices. (2) When addresses are ready in the DRAM-controller, an Interface Circuitry enables pre-decoding Row/Column addresses into the DRAM before other Commands, thus accelerating Random-Access Row/Column Times by 1.5ns, respectively.
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