D. Louderback, R. V. Stone, K. Graham, P. Guilfoyle, K. Choquette, J. Klem, D. Serkland
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We present results on the development of monolithic 1300 nm VCSELs designed for flip-chip bonding. Nearly identical top- and bottom-emitting VCSEL structures were utilized to evaluate the performance of flip-chip VCSELs.
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