{"title":"基于埋地电容仿真与测量的纳米复合材料高频特性研究","authors":"Massar Wade, G. Duchamp, T. Dubois, I. B. Majek","doi":"10.1109/EUROSIME.2016.7463390","DOIUrl":null,"url":null,"abstract":"Passive components embedded into printed circuit boards (PCBs) are of great interest to enhance the size reduction, the integration density increase and the number of functionalities of electronic circuits. This technology enables to increase the operating frequency towards higher frequencies and improve the reliability. A large number of passive components used on an electronic board are capacitive. So their study involves the biggest challenge for burying into PCBs due to the large range of capacitance required and the large frequency domain of applications. This paper deals with the high frequency characterization and the determination of the frequency dependence of the permittivity of innovative dielectric nanocomposite materials involved in capacitive structures, based on simulations and measurements.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"293 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High frequency characterization of nanocomposite materials based on simulation and measurement of buried capacitors\",\"authors\":\"Massar Wade, G. Duchamp, T. Dubois, I. B. Majek\",\"doi\":\"10.1109/EUROSIME.2016.7463390\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Passive components embedded into printed circuit boards (PCBs) are of great interest to enhance the size reduction, the integration density increase and the number of functionalities of electronic circuits. This technology enables to increase the operating frequency towards higher frequencies and improve the reliability. A large number of passive components used on an electronic board are capacitive. So their study involves the biggest challenge for burying into PCBs due to the large range of capacitance required and the large frequency domain of applications. This paper deals with the high frequency characterization and the determination of the frequency dependence of the permittivity of innovative dielectric nanocomposite materials involved in capacitive structures, based on simulations and measurements.\",\"PeriodicalId\":438097,\"journal\":{\"name\":\"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"293 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-04-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2016.7463390\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2016.7463390","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High frequency characterization of nanocomposite materials based on simulation and measurement of buried capacitors
Passive components embedded into printed circuit boards (PCBs) are of great interest to enhance the size reduction, the integration density increase and the number of functionalities of electronic circuits. This technology enables to increase the operating frequency towards higher frequencies and improve the reliability. A large number of passive components used on an electronic board are capacitive. So their study involves the biggest challenge for burying into PCBs due to the large range of capacitance required and the large frequency domain of applications. This paper deals with the high frequency characterization and the determination of the frequency dependence of the permittivity of innovative dielectric nanocomposite materials involved in capacitive structures, based on simulations and measurements.