建立微控制器ICEM-CE模型的新方法

2021 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM) Pub Date : 2021-11-28 DOI:10.1109/iwem53379.2021.9790696

Li Yuanhao, Xie Shuguo, Chen Yishu

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引用次数: 1

摘要

为了预测电路板的传导发射性能，制造商需要向用户提供芯片的电磁兼容性(EMC)模型。IEC62433-2标准中提出的集成电路发射模型-传导发射(ICEM-CE)建模方法可以针对各种有源芯片，但对具有典型电磁兼容特性的芯片缺乏专一性。在本文中，我们提出了一种微控制器(mcu)的参数化模型构建方法。通过对单片机内部活动特性的研究，获得了单片机的通用先验信息，并建立了参数化模型。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A New Methodology to Build the ICEM-CE Model for Microcontroller Units

In order to predict the conduction emission performance of a circuit board, manufacturers need to provide the electromagnetic compatibility (EMC) model of the chip to users. The Integrated circuit emission model-conducted emissions (ICEM-CE) modelling method proposed in standard IEC62433-2 can target various active chips, but lacks specificity for chips with typical characteristics of electromagnetic compatibility. In this paper, we propose a parametric model construction method for microcontroller units (MCUs). By studying the characteristics of the internal activity (IA) of the MCUs, the universal prior information for MCUs is obtained, and the parameterized model is constructed.

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2021 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)

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