用于首次失效预测的无铅焊料疲劳寿命模型的建立

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI:10.1109/ectc51906.2022.00256

F. Che, Yeow Chon Ong, H. Ng, L. Pan, Christopher D. Glancey, K. Sinha, Richard Fan

{"title":"用于首次失效预测的无铅焊料疲劳寿命模型的建立","authors":"F. Che, Yeow Chon Ong, H. Ng, L. Pan, Christopher D. Glancey, K. Sinha, Richard Fan","doi":"10.1109/ectc51906.2022.00256","DOIUrl":null,"url":null,"abstract":"First failure (FF) fatigue life model of lead-free solder is not available from literature, especially for package used in mobile application. In this study, fatigue life model for FF prediction under temperature cycling test has been developed for low-Ag content solder joint used in board level assembly through reliability test and finite element analysis and simulation. The developed life model is validated and has a good accuracy with +/-20% error between prediction and physical testing data. Volume selection is discussed for better understanding the failure mode and site. Relationship between FF and characteristic life is also studied.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Development on Fatigue Life Model of Lead-Free Solder for First Failure Prediction\",\"authors\":\"F. Che, Yeow Chon Ong, H. Ng, L. Pan, Christopher D. Glancey, K. Sinha, Richard Fan\",\"doi\":\"10.1109/ectc51906.2022.00256\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"First failure (FF) fatigue life model of lead-free solder is not available from literature, especially for package used in mobile application. In this study, fatigue life model for FF prediction under temperature cycling test has been developed for low-Ag content solder joint used in board level assembly through reliability test and finite element analysis and simulation. The developed life model is validated and has a good accuracy with +/-20% error between prediction and physical testing data. Volume selection is discussed for better understanding the failure mode and site. Relationship between FF and characteristic life is also studied.\",\"PeriodicalId\":139520,\"journal\":{\"name\":\"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ectc51906.2022.00256\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc51906.2022.00256","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 5

摘要

无铅焊料的首次失效(FF)疲劳寿命模型在文献中没有，特别是在移动应用中使用的封装。本研究通过可靠性试验和有限元分析仿真，建立了用于板级装配低银含量焊点温度循环试验下FF预测的疲劳寿命模型。开发的寿命模型经过验证，具有良好的精度，预测与物理测试数据误差为+/-20%。讨论了体积选择，以便更好地了解失效模式和地点。研究了FF与特性寿命的关系。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Development on Fatigue Life Model of Lead-Free Solder for First Failure Prediction

First failure (FF) fatigue life model of lead-free solder is not available from literature, especially for package used in mobile application. In this study, fatigue life model for FF prediction under temperature cycling test has been developed for low-Ag content solder joint used in board level assembly through reliability test and finite element analysis and simulation. The developed life model is validated and has a good accuracy with +/-20% error between prediction and physical testing data. Volume selection is discussed for better understanding the failure mode and site. Relationship between FF and characteristic life is also studied.

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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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