Sridhar Sivapurapu, R. Chen, M. Rehman, Kimiyuki Kanno, Takenori Kakutani, M. Letz, Fuhan Liu, S. Sitaraman, M. Swaminathan
{"title":"用于射频应用的柔性和超薄玻璃基板","authors":"Sridhar Sivapurapu, R. Chen, M. Rehman, Kimiyuki Kanno, Takenori Kakutani, M. Letz, Fuhan Liu, S. Sitaraman, M. Swaminathan","doi":"10.1109/ECTC32696.2021.00260","DOIUrl":null,"url":null,"abstract":"Glass has been shown to be a capable core substrate material for high frequency applications. In this paper we examine the capabilities of ultra-thin glass as a flexible material that can be used for high frequency flexible applications. The two stack-ups discussed in this paper are $60\\ \\mu\\mathrm{m}$ in total thickness with a core glass substrate (Schott AF32) of $30\\ \\mu\\mathrm{m}$ thickness. One stack-up uses $15\\ \\mu\\mathrm{m}$ JSR GT-N01 as a buildup dielectric and the other uses $15\\ \\mu\\mathrm{m}$ Taiyo Photo Imageable Dielectric. Since neither of these stack-ups have previously been electrically characterized, this paper characterizes both stack-ups up to 110 GHz using microstrip ring resonators (MRRs) and conductor backed coplanar waveguides (CBCPWs). Based on the characterization results, these stack-ups compare favorably against other stack-ups used for applications in this frequency range. After completing the electrical characterization, the Taiyo PID stack-up is also mechanically characterized for its flexibility using Free Arc Bending. The Free Arc Bending test shows that the ultra-thin glass stack-up is suitable for high frequency bending applications as the tested samples are capable of bending up to a separation of 33% of the sample's total length, displaying the capabilities of this ultra-thin glass substrate as a good candidate for a flexible substrate.","PeriodicalId":351817,"journal":{"name":"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Flexible and Ultra-Thin Glass Substrates for RF Applications\",\"authors\":\"Sridhar Sivapurapu, R. Chen, M. Rehman, Kimiyuki Kanno, Takenori Kakutani, M. Letz, Fuhan Liu, S. Sitaraman, M. Swaminathan\",\"doi\":\"10.1109/ECTC32696.2021.00260\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Glass has been shown to be a capable core substrate material for high frequency applications. In this paper we examine the capabilities of ultra-thin glass as a flexible material that can be used for high frequency flexible applications. The two stack-ups discussed in this paper are $60\\\\ \\\\mu\\\\mathrm{m}$ in total thickness with a core glass substrate (Schott AF32) of $30\\\\ \\\\mu\\\\mathrm{m}$ thickness. One stack-up uses $15\\\\ \\\\mu\\\\mathrm{m}$ JSR GT-N01 as a buildup dielectric and the other uses $15\\\\ \\\\mu\\\\mathrm{m}$ Taiyo Photo Imageable Dielectric. Since neither of these stack-ups have previously been electrically characterized, this paper characterizes both stack-ups up to 110 GHz using microstrip ring resonators (MRRs) and conductor backed coplanar waveguides (CBCPWs). Based on the characterization results, these stack-ups compare favorably against other stack-ups used for applications in this frequency range. After completing the electrical characterization, the Taiyo PID stack-up is also mechanically characterized for its flexibility using Free Arc Bending. The Free Arc Bending test shows that the ultra-thin glass stack-up is suitable for high frequency bending applications as the tested samples are capable of bending up to a separation of 33% of the sample's total length, displaying the capabilities of this ultra-thin glass substrate as a good candidate for a flexible substrate.\",\"PeriodicalId\":351817,\"journal\":{\"name\":\"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC32696.2021.00260\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC32696.2021.00260","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Flexible and Ultra-Thin Glass Substrates for RF Applications
Glass has been shown to be a capable core substrate material for high frequency applications. In this paper we examine the capabilities of ultra-thin glass as a flexible material that can be used for high frequency flexible applications. The two stack-ups discussed in this paper are $60\ \mu\mathrm{m}$ in total thickness with a core glass substrate (Schott AF32) of $30\ \mu\mathrm{m}$ thickness. One stack-up uses $15\ \mu\mathrm{m}$ JSR GT-N01 as a buildup dielectric and the other uses $15\ \mu\mathrm{m}$ Taiyo Photo Imageable Dielectric. Since neither of these stack-ups have previously been electrically characterized, this paper characterizes both stack-ups up to 110 GHz using microstrip ring resonators (MRRs) and conductor backed coplanar waveguides (CBCPWs). Based on the characterization results, these stack-ups compare favorably against other stack-ups used for applications in this frequency range. After completing the electrical characterization, the Taiyo PID stack-up is also mechanically characterized for its flexibility using Free Arc Bending. The Free Arc Bending test shows that the ultra-thin glass stack-up is suitable for high frequency bending applications as the tested samples are capable of bending up to a separation of 33% of the sample's total length, displaying the capabilities of this ultra-thin glass substrate as a good candidate for a flexible substrate.