使用IBIS模型的板级信号完整性分析的完整解决方案

Zahra Shariati, N. Masoumi, M. Mehri
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引用次数: 4

摘要

在这项工作中,IBIS被用来估计包装的不利影响,并在其表示中提出了一些修改。IBIS是一种在系统设计层面广泛流行的标准文件类型。如今,许多供应商、设计师和电路模拟器生产、使用和接受这个标准。它代表了考虑封装寄生效应的数字电路I/O缓冲器的行为。我们对IBIS的修改可以更好地理解封装和数字I/O。考虑到两个芯片之间的导线连接,测试了不同的传统封装。研究了封装和I/O以及线延迟、过调和欠调对信号转换的影响。封装对传输延迟的寄生不利影响高达41%,对过调电压的寄生不利影响高达38%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A complete solution for Board-Level Signal Integrity Analysis Using IBIS Models
In this work the IBIS is employed to estimate the adverse effects of package wheresome modifications in its representation are proposed. IBIS is a standard file type which is widely popular in system design level. Many vendors, designers, and circuit simulators produce, use, and accept this standard nowadays. It represents the behavior of the I/O buffer of digital circuit considering their package parasitic effects. Our modifications on IBIS give rise to be better understanding of the package and digital I/O. The different conventional packages are tested considering wire connection between two chips. The effects of package and I/O, in companion with wire delay, overshoot, and undershoot on signal transition, are studied. The parasitic adverse effect of package can be as high as 41% for propagation delay and 38% for overshoot voltage.
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