{"title":"使用IBIS模型的板级信号完整性分析的完整解决方案","authors":"Zahra Shariati, N. Masoumi, M. Mehri","doi":"10.1109/MMS.2013.6663098","DOIUrl":null,"url":null,"abstract":"In this work the IBIS is employed to estimate the adverse effects of package wheresome modifications in its representation are proposed. IBIS is a standard file type which is widely popular in system design level. Many vendors, designers, and circuit simulators produce, use, and accept this standard nowadays. It represents the behavior of the I/O buffer of digital circuit considering their package parasitic effects. Our modifications on IBIS give rise to be better understanding of the package and digital I/O. The different conventional packages are tested considering wire connection between two chips. The effects of package and I/O, in companion with wire delay, overshoot, and undershoot on signal transition, are studied. The parasitic adverse effect of package can be as high as 41% for propagation delay and 38% for overshoot voltage.","PeriodicalId":361750,"journal":{"name":"2013 13th Mediterranean Microwave Symposium (MMS)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-11-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"A complete solution for Board-Level Signal Integrity Analysis Using IBIS Models\",\"authors\":\"Zahra Shariati, N. Masoumi, M. Mehri\",\"doi\":\"10.1109/MMS.2013.6663098\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work the IBIS is employed to estimate the adverse effects of package wheresome modifications in its representation are proposed. IBIS is a standard file type which is widely popular in system design level. Many vendors, designers, and circuit simulators produce, use, and accept this standard nowadays. It represents the behavior of the I/O buffer of digital circuit considering their package parasitic effects. Our modifications on IBIS give rise to be better understanding of the package and digital I/O. The different conventional packages are tested considering wire connection between two chips. The effects of package and I/O, in companion with wire delay, overshoot, and undershoot on signal transition, are studied. The parasitic adverse effect of package can be as high as 41% for propagation delay and 38% for overshoot voltage.\",\"PeriodicalId\":361750,\"journal\":{\"name\":\"2013 13th Mediterranean Microwave Symposium (MMS)\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-11-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 13th Mediterranean Microwave Symposium (MMS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MMS.2013.6663098\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 13th Mediterranean Microwave Symposium (MMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MMS.2013.6663098","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A complete solution for Board-Level Signal Integrity Analysis Using IBIS Models
In this work the IBIS is employed to estimate the adverse effects of package wheresome modifications in its representation are proposed. IBIS is a standard file type which is widely popular in system design level. Many vendors, designers, and circuit simulators produce, use, and accept this standard nowadays. It represents the behavior of the I/O buffer of digital circuit considering their package parasitic effects. Our modifications on IBIS give rise to be better understanding of the package and digital I/O. The different conventional packages are tested considering wire connection between two chips. The effects of package and I/O, in companion with wire delay, overshoot, and undershoot on signal transition, are studied. The parasitic adverse effect of package can be as high as 41% for propagation delay and 38% for overshoot voltage.