用于逆变器的碳化硅功率模块的电气设计与建模

V. S. Bhaskar, Jong Ming Chinq, Kazunori Yamamoto, G. Tang
{"title":"用于逆变器的碳化硅功率模块的电气设计与建模","authors":"V. S. Bhaskar, Jong Ming Chinq, Kazunori Yamamoto, G. Tang","doi":"10.1109/ectc51906.2022.00320","DOIUrl":null,"url":null,"abstract":"In this paper, electrical design and modeling of silicon carbide power modules for inverter applications are discussed. A 6-in-l silicon carbide MOSFET power module is proposed, and its package is described and analyzed. The electrical design and modeling are done using Ansys Q3D simulation to extract the parasitic inductances and capacitances. The computed power loop inductance is 6.21 nH, gate loop inductance is 1.94 nH, while the parasitic capacitance is 29.98 pF.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electrical Design and Modeling of Silicon Carbide Power Modules for Inverter Applications\",\"authors\":\"V. S. Bhaskar, Jong Ming Chinq, Kazunori Yamamoto, G. Tang\",\"doi\":\"10.1109/ectc51906.2022.00320\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, electrical design and modeling of silicon carbide power modules for inverter applications are discussed. A 6-in-l silicon carbide MOSFET power module is proposed, and its package is described and analyzed. The electrical design and modeling are done using Ansys Q3D simulation to extract the parasitic inductances and capacitances. The computed power loop inductance is 6.21 nH, gate loop inductance is 1.94 nH, while the parasitic capacitance is 29.98 pF.\",\"PeriodicalId\":139520,\"journal\":{\"name\":\"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ectc51906.2022.00320\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc51906.2022.00320","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文讨论了用于逆变器的碳化硅功率模块的电气设计和建模。提出了一种6-in- 1碳化硅MOSFET功率模块,并对其封装进行了描述和分析。利用Ansys Q3D仿真软件进行了电气设计和建模,提取了寄生电感和寄生电容。计算得到功率回路电感为6.21 nH,门回路电感为1.94 nH,寄生电容为29.98 pF。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical Design and Modeling of Silicon Carbide Power Modules for Inverter Applications
In this paper, electrical design and modeling of silicon carbide power modules for inverter applications are discussed. A 6-in-l silicon carbide MOSFET power module is proposed, and its package is described and analyzed. The electrical design and modeling are done using Ansys Q3D simulation to extract the parasitic inductances and capacitances. The computed power loop inductance is 6.21 nH, gate loop inductance is 1.94 nH, while the parasitic capacitance is 29.98 pF.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信