采用金属基复合材料基板的混合动力模块:评价

S. Azzopardi, J.-M. Thebaud, E. Woirgard, C. Zardini
{"title":"采用金属基复合材料基板的混合动力模块:评价","authors":"S. Azzopardi, J.-M. Thebaud, E. Woirgard, C. Zardini","doi":"10.1109/IEMTIM.1998.704558","DOIUrl":null,"url":null,"abstract":"This paper presents an evaluation of the reliability of hybrid power modules using a metal matrix composite baseplate. In this study, we investigate the possible damage in the assemblies by measuring their thermal resistance. Several 2\"/spl times/1\" power module samples including four bipolar transistors (BUX48) have been realized with the use of a vacuum bake soldering machine allowing reduction of voids in the solder joints. The test vehicles have been submitted to liquid-liquid thermal shocks (+125/spl deg/C/-55/spl deg/C). Every 250 thermal shocks, two samples were extracted in order to measure the thermal resistance. Results show that even after 2700 shocks, only a very small increase in the thermal resistance of the assemblies is observed. In comparison, modules with a copper baseplate show a strong increase in thermal resistance and fail much earlier. As a consequence, in applications where thermal cycling is involved, hybrid power modules with metal matrix composite baseplates will offer much better reliability. SEM observations conducted on cross-sectioned samples and acoustic analysis do not show the typical cracks generally observed in solder joints between the direct bonded copper substrate and the copper baseplate of aged modules.","PeriodicalId":260028,"journal":{"name":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Hybrid power modules using a metal matrix composite baseplate: An evaluation\",\"authors\":\"S. Azzopardi, J.-M. Thebaud, E. Woirgard, C. Zardini\",\"doi\":\"10.1109/IEMTIM.1998.704558\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an evaluation of the reliability of hybrid power modules using a metal matrix composite baseplate. In this study, we investigate the possible damage in the assemblies by measuring their thermal resistance. Several 2\\\"/spl times/1\\\" power module samples including four bipolar transistors (BUX48) have been realized with the use of a vacuum bake soldering machine allowing reduction of voids in the solder joints. The test vehicles have been submitted to liquid-liquid thermal shocks (+125/spl deg/C/-55/spl deg/C). Every 250 thermal shocks, two samples were extracted in order to measure the thermal resistance. Results show that even after 2700 shocks, only a very small increase in the thermal resistance of the assemblies is observed. In comparison, modules with a copper baseplate show a strong increase in thermal resistance and fail much earlier. As a consequence, in applications where thermal cycling is involved, hybrid power modules with metal matrix composite baseplates will offer much better reliability. SEM observations conducted on cross-sectioned samples and acoustic analysis do not show the typical cracks generally observed in solder joints between the direct bonded copper substrate and the copper baseplate of aged modules.\",\"PeriodicalId\":260028,\"journal\":{\"name\":\"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-04-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMTIM.1998.704558\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMTIM.1998.704558","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

本文对采用金属基复合材料基板的混合动力模块的可靠性进行了评估。在本研究中,我们通过测量其热阻来研究组件中可能存在的损伤。利用真空烤焊机减少焊点的空隙,实现了包括四个双极晶体管(BUX48)在内的几个2“/spl倍/1”功率模块样品。测试车辆已经提交了液-液热冲击(+125/spl°C/-55/spl°C)。每250次热冲击,提取两个样品,以测量热阻。结果表明,即使在2700次冲击后,组件的热阻也只有很小的增加。相比之下,使用铜基板的模块显示出热阻的大幅增加,并且更早失效。因此,在涉及热循环的应用中,带有金属基复合材料基板的混合动力模块将提供更好的可靠性。对横截面样品进行的SEM观察和声学分析没有显示出在老化模块的铜基板和铜基板之间的直接结合的焊点中通常观察到的典型裂纹。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hybrid power modules using a metal matrix composite baseplate: An evaluation
This paper presents an evaluation of the reliability of hybrid power modules using a metal matrix composite baseplate. In this study, we investigate the possible damage in the assemblies by measuring their thermal resistance. Several 2"/spl times/1" power module samples including four bipolar transistors (BUX48) have been realized with the use of a vacuum bake soldering machine allowing reduction of voids in the solder joints. The test vehicles have been submitted to liquid-liquid thermal shocks (+125/spl deg/C/-55/spl deg/C). Every 250 thermal shocks, two samples were extracted in order to measure the thermal resistance. Results show that even after 2700 shocks, only a very small increase in the thermal resistance of the assemblies is observed. In comparison, modules with a copper baseplate show a strong increase in thermal resistance and fail much earlier. As a consequence, in applications where thermal cycling is involved, hybrid power modules with metal matrix composite baseplates will offer much better reliability. SEM observations conducted on cross-sectioned samples and acoustic analysis do not show the typical cracks generally observed in solder joints between the direct bonded copper substrate and the copper baseplate of aged modules.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信