S. Azzopardi, J.-M. Thebaud, E. Woirgard, C. Zardini
{"title":"采用金属基复合材料基板的混合动力模块:评价","authors":"S. Azzopardi, J.-M. Thebaud, E. Woirgard, C. Zardini","doi":"10.1109/IEMTIM.1998.704558","DOIUrl":null,"url":null,"abstract":"This paper presents an evaluation of the reliability of hybrid power modules using a metal matrix composite baseplate. In this study, we investigate the possible damage in the assemblies by measuring their thermal resistance. Several 2\"/spl times/1\" power module samples including four bipolar transistors (BUX48) have been realized with the use of a vacuum bake soldering machine allowing reduction of voids in the solder joints. The test vehicles have been submitted to liquid-liquid thermal shocks (+125/spl deg/C/-55/spl deg/C). Every 250 thermal shocks, two samples were extracted in order to measure the thermal resistance. Results show that even after 2700 shocks, only a very small increase in the thermal resistance of the assemblies is observed. In comparison, modules with a copper baseplate show a strong increase in thermal resistance and fail much earlier. As a consequence, in applications where thermal cycling is involved, hybrid power modules with metal matrix composite baseplates will offer much better reliability. SEM observations conducted on cross-sectioned samples and acoustic analysis do not show the typical cracks generally observed in solder joints between the direct bonded copper substrate and the copper baseplate of aged modules.","PeriodicalId":260028,"journal":{"name":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Hybrid power modules using a metal matrix composite baseplate: An evaluation\",\"authors\":\"S. Azzopardi, J.-M. Thebaud, E. Woirgard, C. Zardini\",\"doi\":\"10.1109/IEMTIM.1998.704558\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an evaluation of the reliability of hybrid power modules using a metal matrix composite baseplate. In this study, we investigate the possible damage in the assemblies by measuring their thermal resistance. Several 2\\\"/spl times/1\\\" power module samples including four bipolar transistors (BUX48) have been realized with the use of a vacuum bake soldering machine allowing reduction of voids in the solder joints. The test vehicles have been submitted to liquid-liquid thermal shocks (+125/spl deg/C/-55/spl deg/C). Every 250 thermal shocks, two samples were extracted in order to measure the thermal resistance. Results show that even after 2700 shocks, only a very small increase in the thermal resistance of the assemblies is observed. In comparison, modules with a copper baseplate show a strong increase in thermal resistance and fail much earlier. As a consequence, in applications where thermal cycling is involved, hybrid power modules with metal matrix composite baseplates will offer much better reliability. SEM observations conducted on cross-sectioned samples and acoustic analysis do not show the typical cracks generally observed in solder joints between the direct bonded copper substrate and the copper baseplate of aged modules.\",\"PeriodicalId\":260028,\"journal\":{\"name\":\"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-04-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMTIM.1998.704558\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMTIM.1998.704558","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Hybrid power modules using a metal matrix composite baseplate: An evaluation
This paper presents an evaluation of the reliability of hybrid power modules using a metal matrix composite baseplate. In this study, we investigate the possible damage in the assemblies by measuring their thermal resistance. Several 2"/spl times/1" power module samples including four bipolar transistors (BUX48) have been realized with the use of a vacuum bake soldering machine allowing reduction of voids in the solder joints. The test vehicles have been submitted to liquid-liquid thermal shocks (+125/spl deg/C/-55/spl deg/C). Every 250 thermal shocks, two samples were extracted in order to measure the thermal resistance. Results show that even after 2700 shocks, only a very small increase in the thermal resistance of the assemblies is observed. In comparison, modules with a copper baseplate show a strong increase in thermal resistance and fail much earlier. As a consequence, in applications where thermal cycling is involved, hybrid power modules with metal matrix composite baseplates will offer much better reliability. SEM observations conducted on cross-sectioned samples and acoustic analysis do not show the typical cracks generally observed in solder joints between the direct bonded copper substrate and the copper baseplate of aged modules.