{"title":"当温度下降较大时，有效系数增大","authors":"V. Yurchenko","doi":"10.1109/ICT.1996.553293","DOIUrl":null,"url":null,"abstract":"Optimum configuration, assembling and commutation of the cells in a thermoelectric device have been investigated taking into account the temperature dependence of resistivity, thermal conductivity and Seebeck coefficient of the material operating at the large temperature drop. A solution is proposed which enables one to increase the effective figure of merit of the device as compared to the mean value of Z measured at the same temperature drop in a single wafer thermoelectric cell.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effective figure of merit increase at the large temperature drops\",\"authors\":\"V. Yurchenko\",\"doi\":\"10.1109/ICT.1996.553293\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Optimum configuration, assembling and commutation of the cells in a thermoelectric device have been investigated taking into account the temperature dependence of resistivity, thermal conductivity and Seebeck coefficient of the material operating at the large temperature drop. A solution is proposed which enables one to increase the effective figure of merit of the device as compared to the mean value of Z measured at the same temperature drop in a single wafer thermoelectric cell.\",\"PeriodicalId\":447328,\"journal\":{\"name\":\"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-03-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICT.1996.553293\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICT.1996.553293","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effective figure of merit increase at the large temperature drops
Optimum configuration, assembling and commutation of the cells in a thermoelectric device have been investigated taking into account the temperature dependence of resistivity, thermal conductivity and Seebeck coefficient of the material operating at the large temperature drop. A solution is proposed which enables one to increase the effective figure of merit of the device as compared to the mean value of Z measured at the same temperature drop in a single wafer thermoelectric cell.
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