用于共封装光学器件的无源对准玻璃波导连接器

2021 European Conference on Optical Communication (ECOC) Pub Date : 2021-09-13 DOI:10.1109/ecoc52684.2021.9605856

L. Brusberg, Jason R. Grenier, Jürgen Matthies, Allen M. Miller, Chad C. Terwilliger, Jeffrey S. Clark, Beibei Zeng, Pierre Beneke

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引用次数: 5

摘要

共封装光学需要新颖的封装概念，以实现高光纤计数和低成本组装。我们设计并制造了一种具有MPO接口的玻璃波导基板，其平均连接器损耗为0.5 dB。进行了模拟以评估物理接触所需的弹簧力。

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Passive Aligned Glass Waveguide Connector for Co-Packaged Optics

Co-packaged optics require novel packaging concepts for high fiber counts and low-cost assembly. We design and fabricate a glass waveguide substrate with MPO interfaces that yield an average connector loss of 0.5 dB. Simulations are performed to assess the required spring force for physical contact.

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来源期刊

2021 European Conference on Optical Communication (ECOC)

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