4H-SiC衬底上NiOx MSM结构的制备与研究

Xi Wang, Meng Zhang, H. Pu, Jichao Hu, Qing-hai Dong, Chunlan Chen, Bei Xu, Guowen Yang
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引用次数: 0

摘要

采用射频磁控溅射技术,在4H-SiC衬底上制备了氧化镍金属-半导体-金属结构。x射线衍射和扫描电镜结果表明,在碳化硅表面溅射的非化学计量氧化镍为纳米晶。测量了器件的电流和电压特性。当365 nm入射光触发时,1 V和-1 V的电流分别为2.28 mA和-2.26 mA。同时,在1 V和-1 V时,暗电流均小至26 $\mu$ A。此外,还研究了NiOx MSM结构的二次导通行为。结果表明,从镍电极向氧化镍流动的电子存在3.35 eV的势垒。在此基础上,建立并模拟了该器件二次导通行为的等效电路。模拟曲线与实验曲线吻合较好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fabrication and Investigation of NiOx MSM Structure on 4H-SiC Substrate
Nickel oxide metal-semiconductor-metal structure was fabricated on 4H-SiC substrate by radio frequency magnetron sputtering from nickel oxide target and following electrode process. X-ray diffraction and scanning electron microscopy results indicate that the sputtered non-stoichiometric nickel oxide on silicon carbide is nanocrystalline. The current and voltage characteristic of the fabricated device was measured. When triggered by 365 nm incoming light, the current at 1 V and -1 V are 2.28 mA and -2.26 mA, respectively. Meanwhile, the dark current was as small as 26 $\mu$ A at both 1 V and -1 V. Furthermore, the secondary turn on behavior of the NiOx MSM structure was investigated. The results indicate that there are 3.35 eV barriers for electrons flowing from nickel electrodes to nickel oxide. Based on the investigated results, the equivalent circuit for secondary turn on behavior of the fabricated device was set up and simulated. The simulated curve matches the experimental curve well.
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