铜互连失效——定位、分析和退化机制

Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 Pub Date : 2003-07-07 DOI:10.1109/IPFA.2003.1222735

E. Zschech, E. Langer, M. Meyer

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引用次数: 3

摘要

在本文中，我们重点介绍了铜互连中的失效以及用于物理失效分析的分析技术。利用扫描电镜(SEM)观察了真空部分降解后的电迁移试验结构。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Failures in copper interconnects-localization, analysis and degradation mechanisms

In this paper, we focussed about the failures in copper interconnects and on analytical techniques that are applied for physical failure analysis. Electromigration test structure after partial degradation by voiding was observed using SEM images.

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Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003

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