45纳米技术节点的高压SOI mesfet

W. Lepkowski, S. Wilk, M. R. Ghajar, T. Thornton
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引用次数: 5

摘要

增强型SOI mesfet已在高尺度CMOS工艺上得到验证。它们的直流和射频性能以及再现性表明,它们将是各种模拟和PA应用的理想选择。此外,由于它们可以与45nm CMOS一起制造[4],因此它们似乎适合作为高压外部器件和低压CMOS之间的接口的片上系统应用。虽然这些初步结果令人鼓舞,但新的MESFET几何形状和结构已经被胶带覆盖,以进一步提高击穿电压。最后,随着布局的不断优化,预计设备之间的差异将会减少。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High voltage SOI MESFETs at the 45nm technology node
Enhanced voltage SOI MESFETs have been demonstrated on a highly scaled CMOS process. Their DC and RF performance along with reproducibility suggests that they would be ideal in a variety of analog and PA applications. Also, since they can be fabricated alongside the 45nm CMOS [4], they appear suitable for system-on-chip applications as an interface between high voltage external devices and the low voltage CMOS. While these initial results are encouraging, new MESFET geometries and structures have been taped out to further enhance the breakdown voltage. Lastly, with continued layout optimization it is expected that the variance between devices will be reduced.
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