柔性环氧树脂，用于低应力电子元件封装

Proceedings: Electrical Insulation Conference and Electrical Manufacturing and Coil Winding Conference (Cat. No.99CH37035) Pub Date : 1999-10-26 DOI:10.1109/EEIC.1999.826253

M.T. Phenis

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引用次数: 1

摘要

下面的报告比较了新型热固性ES-100柔性环氧材料与目前市场上两种顶级柔性环氧材料的物理和机械性能。其中一种材料来自美国国内制造商，另一种来自海外制造商。本报告重点介绍了这些环氧材料的热老化特性，以及它们的耐化学性和耐湿气性。

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Flexible epoxy for low stress electronic component encapsulation

The following report compares the physical and mechanical properties of the new Thermoset ES-100 flexible epoxy material with two of the top flexible epoxy materials currently available on the market today. One of these materials is from a domestic US manufacturer and the other is from an overseas manufacturer. This report focuses on the thermal aging characteristics of these epoxy materials along with their chemical resistance and resistance to moisture.

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Proceedings: Electrical Insulation Conference and Electrical Manufacturing and Coil Winding Conference (Cat. No.99CH37035)

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