基于模型的三维稀疏超声阵列缺陷识别

B. Menz
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引用次数: 0

摘要

提出了一种新的缺陷成像技术,该技术能够在较少的硬件和时间开销的情况下,对多种缺陷形状进行区分,并产生精确的图像。利用反射体模型的先验信息,提高了重建算法的效率。应用这种技术的主要要求是有限数量的可能的缺陷形状,每一个都可以用一个足够简单的几何模型来描述。通过应用一维、二维或三维阵列,用很少的发射器和接收器,可以通过很少的测量获得所需的信息。针对具体的测量问题,提出了一种基于模型的重构算法,实现了缺陷的分类和相应模型参数的估计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Model-based defect recognition by 3-dimensional sparse ultrasonic arrays
A new technique for defect imaging is presented which is able to distinguish between several defect shapes and produce an accurate image with small expense of hardware and time. High efficiency is achieved by utilizing a priori information about the reflector models in the reconstruction algorithm. The main requirement for applying this technique is a limited number of possible defect shapes, each of which can be described by a sufficiently simple geometric model. By applying 1-, 2- or 3-dimensional arrays with few transmitters and receivers it is possible to obtain the required information by few measurements. A model-based reconstruction algorithm adapted to the specific measurement problem enables the classification of the defects and the estimation of the corresponding model parameters.
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