{"title":"光电传感器封装概述","authors":"T. Li","doi":"10.1109/SOUTHC.1994.498088","DOIUrl":null,"url":null,"abstract":"This paper emphasizes the infrared sensor/detector packaging. Electro-optical (E-O) sensor packaging is a challenging task. By its nature, it requires one to complete two missions: 1) to expose the sensing element in order to interact with the environment \"transparently\" while detecting the surrounding and 2) to protect sensitive electronics from the harsh environment.","PeriodicalId":164672,"journal":{"name":"Conference Record Southcon","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electro-optical sensor packaging overview\",\"authors\":\"T. Li\",\"doi\":\"10.1109/SOUTHC.1994.498088\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper emphasizes the infrared sensor/detector packaging. Electro-optical (E-O) sensor packaging is a challenging task. By its nature, it requires one to complete two missions: 1) to expose the sensing element in order to interact with the environment \\\"transparently\\\" while detecting the surrounding and 2) to protect sensitive electronics from the harsh environment.\",\"PeriodicalId\":164672,\"journal\":{\"name\":\"Conference Record Southcon\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-03-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Conference Record Southcon\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOUTHC.1994.498088\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Record Southcon","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOUTHC.1994.498088","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper emphasizes the infrared sensor/detector packaging. Electro-optical (E-O) sensor packaging is a challenging task. By its nature, it requires one to complete two missions: 1) to expose the sensing element in order to interact with the environment "transparently" while detecting the surrounding and 2) to protect sensitive electronics from the harsh environment.
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