{"title":"无铅SnAgCu焊料与印制板表面Ni(P)/Au的金属间反应","authors":"K. Zeng, V. Vuorinen, J. Kivilahti","doi":"10.1109/ECTC.2001.927808","DOIUrl":null,"url":null,"abstract":"Due to its toxicity, Pb is likely to be eliminated eventually from electronic products and, therefore, it is important to understand and control the compatibility of the Sn-Ag-Cu solder alloys with Ni(P)/Au metallizations. Transmission electron microscopy and scanning electron microscopy were employed to analyze the interfacial microstructure. The intermetallic compound Cu/sub 6/Sn/sub 5/, containing a small amount of dissolved Ni, was found to form preferentially on the Ni coating. This compound layer served as a barrier for the reaction of Sn with the Ni coating. On the Ni(P) side, a nickel phosphide was identified. Thermodynamic evaluation of the Cu-Ni-Sn system was carried out to rationalize the enrichment of Cu at the solder/finish interface. Effects of the interfacial reactions on joint reliability are discussed.","PeriodicalId":340217,"journal":{"name":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","volume":"84 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"40","resultStr":"{\"title\":\"Intermetallic reactions between lead-free SnAgCu solder and Ni(P)/Au surface finish on PWBs\",\"authors\":\"K. Zeng, V. Vuorinen, J. Kivilahti\",\"doi\":\"10.1109/ECTC.2001.927808\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Due to its toxicity, Pb is likely to be eliminated eventually from electronic products and, therefore, it is important to understand and control the compatibility of the Sn-Ag-Cu solder alloys with Ni(P)/Au metallizations. Transmission electron microscopy and scanning electron microscopy were employed to analyze the interfacial microstructure. The intermetallic compound Cu/sub 6/Sn/sub 5/, containing a small amount of dissolved Ni, was found to form preferentially on the Ni coating. This compound layer served as a barrier for the reaction of Sn with the Ni coating. On the Ni(P) side, a nickel phosphide was identified. Thermodynamic evaluation of the Cu-Ni-Sn system was carried out to rationalize the enrichment of Cu at the solder/finish interface. Effects of the interfacial reactions on joint reliability are discussed.\",\"PeriodicalId\":340217,\"journal\":{\"name\":\"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)\",\"volume\":\"84 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-05-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"40\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2001.927808\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2001.927808","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 40
摘要
由于其毒性，Pb很可能最终从电子产品中被消除，因此，了解和控制Sn-Ag-Cu钎料合金与Ni(P)/Au金属化的相容性非常重要。采用透射电镜和扫描电镜对界面微观结构进行了分析。金属间化合物Cu/sub 6/Sn/sub 5/优先在Ni涂层上形成，其中含有少量溶解的Ni。该复合层为锡与Ni镀层的反应提供了屏障。在Ni(P)侧，发现了一个磷化镍。对Cu- ni - sn体系进行了热力学评价，以使Cu在焊料/抛光界面的富集合理化。讨论了界面反应对节理可靠性的影响。
Intermetallic reactions between lead-free SnAgCu solder and Ni(P)/Au surface finish on PWBs
Due to its toxicity, Pb is likely to be eliminated eventually from electronic products and, therefore, it is important to understand and control the compatibility of the Sn-Ag-Cu solder alloys with Ni(P)/Au metallizations. Transmission electron microscopy and scanning electron microscopy were employed to analyze the interfacial microstructure. The intermetallic compound Cu/sub 6/Sn/sub 5/, containing a small amount of dissolved Ni, was found to form preferentially on the Ni coating. This compound layer served as a barrier for the reaction of Sn with the Ni coating. On the Ni(P) side, a nickel phosphide was identified. Thermodynamic evaluation of the Cu-Ni-Sn system was carried out to rationalize the enrichment of Cu at the solder/finish interface. Effects of the interfacial reactions on joint reliability are discussed.
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