第十届集成电路物理与失效分析国际研讨会论文集。IPFA 2003

Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 Pub Date : 1900-01-01 DOI:10.1109/IPFA.2003.1222709

Alastair Trigg, Daniel Chan, John Thong

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引用次数: 0

摘要

讨论了以下主题:失效分析I;专业设备的可靠性和失效分析;失效分析II;高级互连I;失效分析III;包装相关失效机制;先进的互联;电介质和热载流子可靠性I;电介质和热载流子可靠性II;EOS/ESD和CMOS锁存;故障分析IV;故障分析;

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Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003

The following topics were dealt: Failure analysis I; reliability and failure analysis in specialist devices; failure analysis II; advanced interconnects I; failure analysis III; packaging related failure mechanisms; advanced interconnects; dielectrics and hot carrier reliability I; dielectrics and hot carrier reliability II; EOS/ESD and CMOS latchup; failure analysis IV; failure analysis V.

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Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003

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