一种用于IBM RS/6000 SP系统的新型开关芯片

C. Stunkel, Jay Herring, B. Abali, Rajeev Sivaram
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引用次数: 31

摘要

本文描述了未来IBM RS/6000 SP互连网络中可能出现的第三代交换元件的体系结构。本文将该ASIC称为Switch3开关芯片。与其前身一样,Switch3是一个使用高利用率中央缓冲技术实现输出队列的8端口设备。然而,Switch3通过结合VLSI技术和最近互连网络研究的进步,在这些现有的SP开关芯片上提供了显着的增强。Switch3引入了一种新的自适应路由形式,具有显著提高网络带宽的潜力。它还通过强大的硬件多播复制功能提供对集体通信的支持。该技术的进步使链路带宽提高到每方向每链路500 MB/s,并使中央缓冲区大小比当前的SP交换机增加一倍。此外,更大的Switch3输入缓冲区能够支持长达100米的链路长度,从而实现具有高聚合带宽的丰富连接、可扩展拓扑。最后,Switch3提供了许多其他重要的增强功能,包括对高优先级流量的有限支持和详细的性能监控信息。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A New Switch Chip for IBM RS/6000 SP Systems
This paper describes the architecture of a third-generation switching element which may appear in future IBM RS/6000 SP interconnection networks. In this paper this ASIC will be referred as the Switch3 switch chip. Like its predecessors, Switch3 is an 8-port device implementing output-queuing using the high-utilization central-buffering technique. However, Switch3 offers significant enhancements over these existing SP switch chips by incorporating advances in both VLSI technology and in recent interconnection network research. Switch3 introduces a new form of adaptive routing with the potential to significantly improve network bandwidth. It also offers support for collective communication via a powerful hardware multicast replication capability. The technology advances allow link bandwidth to be improved to 500 MB/s per direction per link, and allow the central buffer size to be doubled compared to the current SP switch. Furthermore, the larger Switch3 input buffers are capable of supporting link lengths of up to 100 meters, enabling richly-connected, scalable topologies with a high aggregate bandwidth. Finally, Switch3 offers a number of other significant enhancements including limited support for high-priority traffic and detailed performance monitoring information.
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