MOS器件中热和辐射诱导的界面陷阱

A. Sogoyan, S.V. Cherepko, V. Pershenkov, V. Rogov, V.N. Ulimov, V. Emelianov
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引用次数: 11

摘要

实验研究了辐照后热退火和辐射诱导电荷中和(RICN)过程中界面陷阱的形成机制。衬底电子的作用在辐照后界面陷阱的建立中是显著的。在保守的低剂量率响应估计方面,发现RICN不能取代标准的热退火试验。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal- and radiation-induced interface traps in MOS devices
The interface trap build-up mechanisms during post-irradiation thermal annealing and radiation-induced charge neutralisation (RICN) are experimentally investigated. The role of substrate electrons is shown to be significant in post-irradiation interface trap build-up. The RICN is found to be incapable to replace a standard thermal annealing test in terms of conservative low dose rate response estimation.
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