识别0.13 /spl mu/m技术开发中的光学邻近校正(OPC)问题

Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 Pub Date : 2003-07-07 DOI:10.1109/IPFA.2003.1222765

Z. Mai, Benjamin Lau, G. Qian, Jian Jun Shi, R. He, Jessica Chin

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引用次数: 0

摘要

在本文中，我们解释了一种故障分析方法，用于识别0.13 /spl mu/m技术开发中的光学接近校正问题。在这里，我们使用持续故障晶圆分类技术进行良率分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Identify Optical Proximity Correction (OPC) issue in 0.13 /spl mu/m technology development

In this paper, we explained a failure analysis methodology to identify optical proximity correction issues in 0.13 /spl mu/m technology development. Here we used, the continue-on-failure wafer sort technology for yield analysis.

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Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003

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