SiC mosfet短路特性分析及新型保护电路设计

Haihong Qin, Yueru Yang, Sixuan Xie, Jiangjin Peng, Haoxiang Hu, F. Bu
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引用次数: 0

摘要

短路性能是关系到碳化硅mosfet安全工作的重要问题之一。分析了SiC MOSFET的短路机理,给出了驱动电路参数对短路特性的影响。与IGBT模块相比,SiC模块具有更高的di/dt和较弱的坚固性,因此传统的去饱和保护电路不能直接用于SiC模块,因为其响应速度相对较慢。在此基础上提出了一种新型的去饱和保护电路,并与传统的去饱和保护电路进行了比较。最后,通过典型硬开关故障和负载下故障的短路保护试验,验证了该去饱和保护电路的有效性。实验结果表明,该去饱和保护方法比传统的去饱和保护方法具有更快的保护速度,能够保证SiC MOSFET功率模块的可靠工作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis of Short-Circuit Characteristics and the Design of a Novel Protection Circuit for SiC MOSFETs
The short-circuit capability is one of the important issues that are related to the safe operation of silicon carbide (SiC) MOSFETs. The short-circuit mechanism of SiC MOSFET is analyzed, and the impact of driving circuit parameters on short-circuit characteristics is presented. Compared to IGBT modules, SiC modules have higher di/dt and weaker ruggedness, so the conventional desaturation protection circuit cannot be directly used for SiC modules due to its relatively slow response. Thus we put forward a novel desaturation protection circuit, and present the comparison between the conventional protection circuit and the novel one. At last, short-circuit protection tests under typical hard switching fault and fault under load was conducted to verify the effectiveness of the novel desaturation protection circuit. The experimental results show that the novel desaturation protection method has a faster protection speed than the conventional one, and can ensure the reliable operation of SiC MOSFET power modules.
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