通过光子线键合实现多芯片集成:将表面和边缘发射激光器连接到硅芯片上

2016 Optical Fiber Communications Conference and Exhibition (OFC) Pub Date : 2016-03-20 DOI:10.1364/OFC.2016.M2I.7

T. Hoose, M. Billah, M. Blaicher, P. Marin, P. Dietrich, A. Hofmann, U. Troppenz, M. Möhrle, N. Lindenmann, M. Thiel, P. Simon, J. Hoffmann, M. Goedecke, W. Freude, C. Koos

{"title":"通过光子线键合实现多芯片集成:将表面和边缘发射激光器连接到硅芯片上","authors":"T. Hoose, M. Billah, M. Blaicher, P. Marin, P. Dietrich, A. Hofmann, U. Troppenz, M. Möhrle, N. Lindenmann, M. Thiel, P. Simon, J. Hoffmann, M. Goedecke, W. Freude, C. Koos","doi":"10.1364/OFC.2016.M2I.7","DOIUrl":null,"url":null,"abstract":"We demonstrate coupling of surface and edge emitting InP lasers to silicon photonic chips using photonic wire bonding. We confirm that back-reflections from the silicon chip do not deteriorate the linewidth of the lasers.","PeriodicalId":284632,"journal":{"name":"2016 Optical Fiber Communications Conference and Exhibition (OFC)","volume":"25 7","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":"{\"title\":\"Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips\",\"authors\":\"T. Hoose, M. Billah, M. Blaicher, P. Marin, P. Dietrich, A. Hofmann, U. Troppenz, M. Möhrle, N. Lindenmann, M. Thiel, P. Simon, J. Hoffmann, M. Goedecke, W. Freude, C. Koos\",\"doi\":\"10.1364/OFC.2016.M2I.7\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We demonstrate coupling of surface and edge emitting InP lasers to silicon photonic chips using photonic wire bonding. We confirm that back-reflections from the silicon chip do not deteriorate the linewidth of the lasers.\",\"PeriodicalId\":284632,\"journal\":{\"name\":\"2016 Optical Fiber Communications Conference and Exhibition (OFC)\",\"volume\":\"25 7\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-03-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 Optical Fiber Communications Conference and Exhibition (OFC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1364/OFC.2016.M2I.7\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 Optical Fiber Communications Conference and Exhibition (OFC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/OFC.2016.M2I.7","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 13

摘要

我们演示了利用光子线键合将表面和边缘发射的InP激光器耦合到硅光子芯片上。我们证实了来自硅芯片的反向反射不会降低激光器的线宽。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips

We demonstrate coupling of surface and edge emitting InP lasers to silicon photonic chips using photonic wire bonding. We confirm that back-reflections from the silicon chip do not deteriorate the linewidth of the lasers.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2016 Optical Fiber Communications Conference and Exhibition (OFC)

自引率

0.00%

发文量