Bi对Sn-3Ag-0.5Cu/Cu焊点金属间化合物生长动力学的影响

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Pub Date : 2006-06-27 DOI:10.1109/HDP.2006.1707598

Jie Zhao, Linge Qi, Lai Wang

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引用次数: 4

摘要

本实验采用Sn-3Ag-0.5Cu、Sn-3Ag-0.5Cu- 1bi和Sn-3Ag-0.5Cu- 3bi三种无铅钎料合金，研究了钎料的显微组织演变和金属间化合物(IMC)层生长动力学。实验结果表明，随着时效温度的升高，钎料/Cu界面处的Cu6Sn5金属间层厚度增加，而Sn-3Ag-0.5Cu-3Bi/Cu钎料中IMC的增长速度要慢于Sn-3Ag-0.5Cu-1Bi/Cu钎料和Sn-Ag-Cu钎料。Bi元素的作用主要是由于Bi元素在接头附近的富集和Bi元素的加入提高了活化能

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Effect of Bi on the kinetics of intermetallics growth in Sn-3Ag-0.5Cu/Cu solder joint

Three lead-free solder alloys, Sn-3Ag-0.5Cu, Sn-3Ag-0.5Cu-1Bi and Sn-3Ag-0.5Cu-3Bi, were used in the current experiments to investigated the microstructural evolution as well as the kinetics of intermetallic compound (IMC) layer growth. The experimental results indicated that the thickness of Cu6Sn5 intermetallic layer at the solder/Cu interface increases with aging temperature, while the growth rate of IMC in Sn-3Ag-0.5Cu-3Bi/Cu joints is slower than that in Sn-3Ag-0.5Cu-1Bi/Cu joints and Sn-Ag-Cu solder joints. The effect of Bi element is attributed to the accumulation of Bi near the joint and the enhancement of the activation energy by the addition of Bi

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Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.

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