一种测量薄膜热导率的新结构

Qing-shan Song, S. Xia, Shaofeng Chen, Zheng Cui
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引用次数: 12

摘要

提出了一种测量薄膜热导率的新型微型装置。它是基于静态的方法,和一个简单的技术被广泛用于测量薄膜的横向热导率。该装置采用微机械加工工艺,将800/spl次/2000/spl亩/米的桥膜与30/spl次/100/spl亩/米的梁制成。穿过梁的桥膜上的加热器和温度计用于产生热流和测量温度。膜,热通量非常均匀,温度均匀分布,已验证了模拟,使系统误差小于传统的矩形结构。利用该技术制备了厚度为0.5 ~ 2/spl μ m的氮化硅薄膜。尺寸效应的测量结果支持薄膜的热导率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A new structure for measuring the thermal conductivity of thin film
A new microdevice for measuring the thermal conductivity of thin film is presented. It is based on the static-state method, which is widely used and a simple technique for measuring the lateral thermal conductivity of thin film. The device is fabricated using micromachining process, which is 800/spl times/2000/spl mu/m bridge membrane with 30/spl times/100/spl mu/m beams. The heater and thermometer across the bridge membrane through the beams are used to create heat flux and to measure the temperature. On the membrane, heat flux is very uniform and the temperature is evenly distributed, which has been verified by simulation, making the system error smaller than conventional rectangular structure. Silicon nitride thin films with thickness from 0.5/spl mu/m to 2/spl mu/m have been investigated using the technique. The measurement result supports the size effect of the thermal conductivity for thin film.
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