通过扫描光致发光测量技术,优化和控制InP及相关技术

S. Krawczyk, K. Schohe, M. Garrigues, J. Tardy
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引用次数: 1

摘要

它显示了扫描光致发光(SPL)测量可以用来获取信息,优化和控制InP和相关的化合物半导体技术。在四种不同的钝化过程中,显示了InP衬底的PL强度如何在连续步骤后变化,并讨论了由此获得的信息。给出了一个例子来说明如何利用声压级测量来优化InP misfet实现中的栅极凹槽步骤。本文描述了利用声压级测量对化合物半导体器件加工过程中连续步骤进行常规内联控制的两种可能性:自动识别和计数声压级图像上出现的缺陷(其中大多数不能通过光学显微镜显示)和分析描述声压级数据的统计参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Expertise, optimisation and control of InP and related technologies by scanning photoluminescence measurements
It is shown how scanning photoluminescence (SPL) measurements can be used to obtain information about, to optimize, and to control InP and related compound semiconductor technologies. It is shown how the PL intensity from an InP substrate varies after successive steps during four different passivation processes, and the information gained thereby is discussed. An example is presented to demonstrate how SPL measurements can be used to optimize the gate recess step in the realization of InP MISFETs. Two possibilities for the routine inline control of successive steps in the processing of compound semiconductor devices using SPL measurements are described: automatic recognition and counting of defects appearing on SPL images (most of which cannot be revealed by optical microscopy) and analysis of statistical parameters describing the SPL data.<>
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