{"title":"单片热释电薄膜红外传感器的新型制备方案","authors":"Wei Zhang, X. Yao, Xiaoqing Wu","doi":"10.1142/S1465876303001927","DOIUrl":null,"url":null,"abstract":"This paper presents a new preparation scheme of monolithic pyroelectric thin film infrared sensor. The sensor can be prepared directly on readout circuit and its electrode can be connected to the readout circuit through a via. PbTiO3 thin film is used as pyroelectric material. Porous SiO2 thin film is applied onto silicon wafer to improve the thermal isolation of the pyroelectric layer. Copper interconnection is used in readout circuit to solve the problem that aluminium interconnection can't endure the annealing temperature of PbTiO3 thin film.","PeriodicalId":331001,"journal":{"name":"Int. J. Comput. Eng. Sci.","volume":"151 10","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Novel Preparation Scheme Of Monolithic Pyroelectric Thin Film Infrared Sensor\",\"authors\":\"Wei Zhang, X. Yao, Xiaoqing Wu\",\"doi\":\"10.1142/S1465876303001927\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a new preparation scheme of monolithic pyroelectric thin film infrared sensor. The sensor can be prepared directly on readout circuit and its electrode can be connected to the readout circuit through a via. PbTiO3 thin film is used as pyroelectric material. Porous SiO2 thin film is applied onto silicon wafer to improve the thermal isolation of the pyroelectric layer. Copper interconnection is used in readout circuit to solve the problem that aluminium interconnection can't endure the annealing temperature of PbTiO3 thin film.\",\"PeriodicalId\":331001,\"journal\":{\"name\":\"Int. J. Comput. Eng. Sci.\",\"volume\":\"151 10\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Int. J. Comput. Eng. Sci.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1142/S1465876303001927\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Int. J. Comput. Eng. Sci.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1142/S1465876303001927","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Novel Preparation Scheme Of Monolithic Pyroelectric Thin Film Infrared Sensor
This paper presents a new preparation scheme of monolithic pyroelectric thin film infrared sensor. The sensor can be prepared directly on readout circuit and its electrode can be connected to the readout circuit through a via. PbTiO3 thin film is used as pyroelectric material. Porous SiO2 thin film is applied onto silicon wafer to improve the thermal isolation of the pyroelectric layer. Copper interconnection is used in readout circuit to solve the problem that aluminium interconnection can't endure the annealing temperature of PbTiO3 thin film.
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