用时域热反射率测量CVD金刚石膜的实验考虑

Thomas L. Rougher, Luke Yates, Zhe Cheng, B. Cola, S. Graham, Ramez Chaeito, A. Sood, M. Ashegi, K. Goodson
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引用次数: 3

摘要

金刚石是已知导热系数最高的块状材料,但合成金刚石薄膜的性能往往远远达不到这一高水平。DARPA电子热管理金刚石薄膜热传输项目汇集了来自五所大学的研究人员,全面表征CVD金刚石薄膜的热传输和材料特性,以更好地进一步改善热传输特性,并了解使用时域热反射和拉曼光谱测量这些特性的准确性。本文总结了采用时域热反射(TDTR)对两种不同系统进行金刚石热测量的结果,并讨论了精确测量具有高表面粗糙度的微米厚各向异性薄膜的热导率的一些困难。我们还报道,在某些情况下,CVD金刚石薄膜的热导率和热边界导率已经得到改善,使它们对高功率电子器件的热管理具有很高的吸引力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Experimental considerations of CVD diamond film measurements using time domain thermoreflectance
Diamond has the highest known thermal conductivity of any known bulk material, but the properties of synthetic diamond films often fall far short of this high level. The DARPA program Thermal Transport in Diamond Films for Electronics Thermal Management brings together researchers from five universities to comprehensively characterize the thermal transport and material properties of CVD diamond thin films in an effort to better how to further improve the thermal transport properties and understand how accurately these properties can be measured using time domain thermoreflectance and Raman spectroscopy. Here we summarize the results of the thermal measurements of diamond conducted via time domain thermoreflectance (TDTR) using two different systems and discuss some difficulties of accurately measuring the thermal conductivity of micron-thick anisotropic films that often have high surface roughness. We also report that in certain cases the thermal conductivity and thermal boundary conductance of CVD diamond films has been improved to the point of making them highly attractive for thermal management of high power electronic devices.
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