J. Mizuno, T. Harada, T. Glinsner, M. Ishizuka, T. Edura, K. Tsutsui, H. Ishida, S. Shoji, Y. Wada
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Fabrications of Micro-Channel Device by Hot Emboss and Direct Bonding of PMMA
We have fabricated and evaluated the mechanical, optical and fluidic characteristics a 50µm wide and a 30µm deep micro-channel device produced by hot emboss and direct bonding of PMMA plate with dimensions of 20mm × 20mm × 1mm. The fabricated micro-channel device was evaluated the bond strength, which was confirmed to be high enough for practical use as well as for quite severe cleaning conditions as ultrasonic cleaning in pure water. The optical loss around bonded interface was also evaluated and no increase in the light absorption was observed. The above results confirmed that the hot emboss and direct bonding technologies for micro-channel manufacturing using the PMMA plates realizes high performance micro channel devices.
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