AlGaN/GaN-on-Si结构的垂直泄漏/击穿机制

Chunhua Zhou, Q. Jiang, Sen Huang, K. J. Chen
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引用次数: 25

摘要

在本文中,我们通过温度相关的电流电压测量研究了在低电阻率p型(111)Si衬底上生长的AlGaN/GaN结构的垂直泄漏/击穿机制。我们认为,从顶部到衬底的垂直泄漏/击穿是由空间电荷限制电流(SCLC)传导机制主导的,该机制涉及缓冲/过渡层中的受体和供体陷阱。基于温度相关的瞬态背门测量,确定了受体能级和供体能级分别为EV+543 meV和EC-616 meV。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Vertical leakage/breakdown mechanisms in AlGaN/GaN-on-Si structures
In this paper, we studied the vertical leakage/breakdown mechanisms in AlGaN/GaN structures grown on low resistivity p-type (111) Si substrate by temperature-dependent current-voltage measurements. We suggested that the top-to-substrate vertical leakage/breakdown is dominated by the space-charge-limited current (SCLC) conduction mechanism involving both acceptor and donor traps in buffer/transition layer. Based on temperature-dependent transient backgating measurements, the acceptor level and donor level were determined to be at EV+543 meV and EC-616 meV, respectively.
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