光学接收器在0.35 μm BiCMOS异构三维集成

2016 IEEE 19th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS) Pub Date : 2016-04-20 DOI:10.1109/DDECS.2016.7482450

D. Milovančev, P. Brandl, N. Vokić, B. Goll, K. Schneider-Hornstein, H. Zimmermann

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引用次数: 2

摘要

高速通信器件的发展范式是在标准硅片上设计的电子元件和光子学的异构三维集成，在不同的工艺中进行优化。本文展示了三维集成的优势，并给出了采用0.35 μm SiGe BiCMOS技术制作的两个接收机的测量结果。第一个是用于光通信的10 Gbit/s可调级配(RGC)接收器，第二个是用于监测光子环调制器工作点的200 Mbit/s TIA。

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Optical receivers in 0.35 μm BiCMOS for heterogeneous 3D integration

Developing paradigm in high speed communication device is heterogeneous 3D integration of electronic components - designed on standard silicon wafers - and photonics, optimized in different processes. This paper shows the advantages of 3D integration and presents the measured results of two receivers fabricated in 0.35 μm SiGe BiCMOS technology. The first is a 10 Gbit/s regulated cascode (RGC) based receiver for optical communications and the second is a 200 Mbit/s TIA for monitoring the operating point of the photonic ring modulator.

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来源期刊

2016 IEEE 19th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS)

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