{"title":"金属化薄膜电容器自愈的实验研究与数值模拟","authors":"V. Belko, O. Emelyanov, I. Ivanov","doi":"10.1109/ICD.2016.7547530","DOIUrl":null,"url":null,"abstract":"Metallized film capacitors have an ability to withstand the breakdown of dielectric film due to a “self-healing” feature. The optimal design of metallized electrodes' patterns guarantees high reliability of metallized film capacitors. This paper presents the results of numerical simulation of the intersegment gate current destruction during self-healing by means of COMSOL Multiphysics software. The model takes into consideration the heat flow from metal layer to polymer film since it has significant influence on destruction process dynamics. The simulation results were shown to be in good agreement with the experimental data.","PeriodicalId":306397,"journal":{"name":"2016 IEEE International Conference on Dielectrics (ICD)","volume":" 27","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"The experimental investigation and numerical simulation of self-healing in metallized film capacitors\",\"authors\":\"V. Belko, O. Emelyanov, I. Ivanov\",\"doi\":\"10.1109/ICD.2016.7547530\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Metallized film capacitors have an ability to withstand the breakdown of dielectric film due to a “self-healing” feature. The optimal design of metallized electrodes' patterns guarantees high reliability of metallized film capacitors. This paper presents the results of numerical simulation of the intersegment gate current destruction during self-healing by means of COMSOL Multiphysics software. The model takes into consideration the heat flow from metal layer to polymer film since it has significant influence on destruction process dynamics. The simulation results were shown to be in good agreement with the experimental data.\",\"PeriodicalId\":306397,\"journal\":{\"name\":\"2016 IEEE International Conference on Dielectrics (ICD)\",\"volume\":\" 27\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE International Conference on Dielectrics (ICD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICD.2016.7547530\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Conference on Dielectrics (ICD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICD.2016.7547530","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The experimental investigation and numerical simulation of self-healing in metallized film capacitors
Metallized film capacitors have an ability to withstand the breakdown of dielectric film due to a “self-healing” feature. The optimal design of metallized electrodes' patterns guarantees high reliability of metallized film capacitors. This paper presents the results of numerical simulation of the intersegment gate current destruction during self-healing by means of COMSOL Multiphysics software. The model takes into consideration the heat flow from metal layer to polymer film since it has significant influence on destruction process dynamics. The simulation results were shown to be in good agreement with the experimental data.
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