用于3G UMTS/WCDMA手机射频子系统的高度集成的0.25 /spl mu/m BiCMOS芯片组

2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers (Cat. No.02CH37280) Pub Date : 2002-06-03 DOI:10.1109/RFIC.2002.1012029

D. Brunel, C. Caron, C. Cordier, E. Soudée

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引用次数: 25

摘要

3G UMTS/WCDMA蜂窝手机射频子系统的完整活动部分由三个rfic实现。该芯片组包括一个完全集成的ZIF接收器，包括RF VCO/PLL和UNITS时钟生成，一个完全集成的直接转换，如发射器，包括RF VCO/PLL，和一个25 dBm平均功率放大器，包括功率检测电路。这三种rfic采用相同的基准0.25 /spl mu/m BiCMOS技术，为更高的集成度提供了可能性。该芯片组针对手机3类和4类(PA仅兼容4类)欧洲和日本3g UMTS和WCDMA标准。

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A highly integrated 0.25 /spl mu/m BiCMOS chipset for 3G UMTS/WCDMA handset RF sub-system

The complete active portion of the 3G UMTS/WCDMA cellular handset RF sub-system is achieved with three RFICs. This chipset comprises a fully integrated ZIF receiver including RF VCO/PLL and UNITS clock generation, a fully Integrated direct conversion like transmitter including RF VCO/PLL, and a 25 dBm average power amplifier including power detection circuitry. The three RFICs use the same baseline 0.25 /spl mu/m BiCMOS technology opening possibilities to even higher integration level. This chipset is targeted at handset class 3 and 4 (PA is class 4 compatible only) European and Japanese 3 G UMTS and WCDMA standards.

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来源期刊

2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers (Cat. No.02CH37280)

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