采用嵌入式晶圆级球栅阵列技术的宽带毫米波e形封装天线

2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO) Pub Date : 2020-12-07 DOI:10.1109/NEMO49486.2020.9343456

Bin Lu, Haoran Zhu, Zongming Duan, Yuefei Dai

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引用次数: 2

摘要

在77 ghz频段的汽车雷达传感器上演示了封装天线(AiP)概念的可行性。采用英飞凌的嵌入式晶圆级球栅阵列(eWLB)封装技术。我们在6×6 mm2 eWLB封装中开发了一个e形贴片天线，其中包含2×2 mm2假Si芯片。从仿真结果来看，该e平面贴片天线具有19.2% (<-10dB)的宽带宽和相对稳定的高增益(6.1 ~ 7.8 dBi)。这些嵌入式雷达传感器的演示结果表明，系统性能优异，集成度高。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A Wideband Millimeter Wave E-shape Antenna in Package with Embedded Wafer Level Ball Grid Array Technology

The feasibility of an antenna-in-package (AiP) concept is demonstrated for automotive radar sensors at the 77 GHz-band. Infineon’s embedded wafer level ball grid array (eWLB) is employed as packaging technology. We developed a E-shape patch antenna in 6×6 mm2 eWLB package that include 2×2 mm2 dummy Si chips. From the simulated results of the proposed E-plane patch antenna, provides a wide bandwidth of 19.2% (|S11|<-10dB) and has a relatively stable high gain varying from 6.1 to 7.8 dBi. The demonstrator result of these embedded radar sensors show an excellent system performance at a high integration level.

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2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)

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