小热休克蛋白的美丽与复杂性:第四届小热休克蛋白研讨会会议记录报告。

IF 4.3 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
ACS Applied Electronic Materials Pub Date : 2023-11-01 Epub Date: 2023-07-18 DOI:10.1007/s12192-023-01360-x
Heath Ecroyd, Britta Bartelt-Kirbach, Anat Ben-Zvi, Raffaella Bonavita, Yevheniia Bushman, Elena Casarotto, Ciro Cecconi, Wilson Chun Yu Lau, Jonathan D Hibshman, Joep Joosten, Virginia Kimonis, Rachel Klevit, Krzysztof Liberek, Kathryn A McMenimen, Tsukumi Miwa, Axel Mogk, Daniele Montepietra, Carsten Peters, Maria Teresa Rocchetti, Dominik Saman, Angela Sisto, Valentina Secco, Annika Strauch, Hideki Taguchi, Morgan Tanguay, Barbara Tedesco, Melinda E Toth, Zihao Wang, Justin L P Benesch, Serena Carra
{"title":"小热休克蛋白的美丽与复杂性:第四届小热休克蛋白研讨会会议记录报告。","authors":"Heath Ecroyd, Britta Bartelt-Kirbach, Anat Ben-Zvi, Raffaella Bonavita, Yevheniia Bushman, Elena Casarotto, Ciro Cecconi, Wilson Chun Yu Lau, Jonathan D Hibshman, Joep Joosten, Virginia Kimonis, Rachel Klevit, Krzysztof Liberek, Kathryn A McMenimen, Tsukumi Miwa, Axel Mogk, Daniele Montepietra, Carsten Peters, Maria Teresa Rocchetti, Dominik Saman, Angela Sisto, Valentina Secco, Annika Strauch, Hideki Taguchi, Morgan Tanguay, Barbara Tedesco, Melinda E Toth, Zihao Wang, Justin L P Benesch, Serena Carra","doi":"10.1007/s12192-023-01360-x","DOIUrl":null,"url":null,"abstract":"<p><p>The Fourth Cell Stress Society International workshop on small heat shock proteins (sHSPs), a follow-up to successful workshops held in 2014, 2016 and 2018, took place as a virtual meeting on the 17-18 November 2022. The meeting was designed to provide an opportunity for those working on sHSPs to reconnect and discuss their latest work. The diversity of research in the sHSP field is reflected in the breadth of topics covered in the talks presented at this meeting. Here we summarise the presentations at this meeting and provide some perspectives on exciting future topics to be addressed in the field.</p>","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":null,"pages":null},"PeriodicalIF":4.3000,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10746627/pdf/","citationCount":"0","resultStr":"{\"title\":\"The beauty and complexity of the small heat shock proteins: a report on the proceedings of the fourth workshop on small heat shock proteins.\",\"authors\":\"Heath Ecroyd, Britta Bartelt-Kirbach, Anat Ben-Zvi, Raffaella Bonavita, Yevheniia Bushman, Elena Casarotto, Ciro Cecconi, Wilson Chun Yu Lau, Jonathan D Hibshman, Joep Joosten, Virginia Kimonis, Rachel Klevit, Krzysztof Liberek, Kathryn A McMenimen, Tsukumi Miwa, Axel Mogk, Daniele Montepietra, Carsten Peters, Maria Teresa Rocchetti, Dominik Saman, Angela Sisto, Valentina Secco, Annika Strauch, Hideki Taguchi, Morgan Tanguay, Barbara Tedesco, Melinda E Toth, Zihao Wang, Justin L P Benesch, Serena Carra\",\"doi\":\"10.1007/s12192-023-01360-x\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p><p>The Fourth Cell Stress Society International workshop on small heat shock proteins (sHSPs), a follow-up to successful workshops held in 2014, 2016 and 2018, took place as a virtual meeting on the 17-18 November 2022. The meeting was designed to provide an opportunity for those working on sHSPs to reconnect and discuss their latest work. The diversity of research in the sHSP field is reflected in the breadth of topics covered in the talks presented at this meeting. Here we summarise the presentations at this meeting and provide some perspectives on exciting future topics to be addressed in the field.</p>\",\"PeriodicalId\":3,\"journal\":{\"name\":\"ACS Applied Electronic Materials\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.3000,\"publicationDate\":\"2023-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10746627/pdf/\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Applied Electronic Materials\",\"FirstCategoryId\":\"99\",\"ListUrlMain\":\"https://doi.org/10.1007/s12192-023-01360-x\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"2023/7/18 0:00:00\",\"PubModel\":\"Epub\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"99","ListUrlMain":"https://doi.org/10.1007/s12192-023-01360-x","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2023/7/18 0:00:00","PubModel":"Epub","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

继2014年、2016年和2018年成功举办小热休克蛋白(sHSPs)国际研讨会之后,第四届细胞应激学会小热休克蛋白(sHSPs)国际研讨会于2022年11月17-18日以虚拟会议的形式举行。此次会议旨在为从事小热休克蛋白研究的人员提供一个重新建立联系和讨论最新工作的机会。在本次会议上发表的演讲涵盖了广泛的主题,反映了 sHSP 领域研究的多样性。在此,我们对本次会议的发言进行了总结,并对该领域未来令人兴奋的研究课题提出了一些展望。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The beauty and complexity of the small heat shock proteins: a report on the proceedings of the fourth workshop on small heat shock proteins.

The Fourth Cell Stress Society International workshop on small heat shock proteins (sHSPs), a follow-up to successful workshops held in 2014, 2016 and 2018, took place as a virtual meeting on the 17-18 November 2022. The meeting was designed to provide an opportunity for those working on sHSPs to reconnect and discuss their latest work. The diversity of research in the sHSP field is reflected in the breadth of topics covered in the talks presented at this meeting. Here we summarise the presentations at this meeting and provide some perspectives on exciting future topics to be addressed in the field.

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CiteScore
7.20
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4.30%
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