Comparison of grain size distributions obtained by XRD and TEM in milled FCC powders

J. Guerrero-Paz , D. Jaramillo-Vigueras
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引用次数: 19

Abstract

Measurements of grain size in powders of the Cu-15at%Al, Cu-20at%Ni, Cu and Ni systems, milled for different times were conducted. X-ray diffraction (XRD) (Warren-Averbach method) and transmission electron microscopy were used for that purpose. From both techniques, distributions of grain diameter (length) were obtained, which permitted to compare both results. Such results were interpreted by considering previous studies of particle size evolution and microstructural evolution. A better comprehension of phenomena that occur in the mechanical alloying, as the grain refinement and the solid solution formation, is attained.

The grain size results obtained by the two techniques were coincident for the Cu-15at%Al system. This system did not present adherence of the powders to the milling media. In the case of the Cu-20at%Ni, Cu and Ni systems, that presented adherence, the results were coincident solely in the powder milled for 864 ks. This is explained due to the microstructural homogenization, reached until that time.

The grain size as a function of the milling time of the two classes of FCC systems, being referred to the adherence phenomenon, presented opposed trends. For example, for the Cu-at15at%Al system, the 70% of the population of grains had a grain size smaller than 7.5, 12 and 20 nm for the milling times of 180, 360 and 864 ks respectively. In the case of the Cu-20at%Ni, Cu and Ni systems, the 70% of the population of grains had a grain size smaller than 35, 22 and 16 nm for the milling times of 180, 360 and 864 ks respectively. These contrary trends reflect different mechanisms of grain size refinement.

A maximum value of grain size of 20 nm required to form the solid solution in the Cu-at15%Al and Cu-20%atNi systems was found.

用XRD和TEM比较了FCC粉的粒度分布
对Cu-15at%Al、Cu-20at%Ni、Cu和Ni体系不同磨矿时间的粉末粒度进行了测量。x射线衍射(XRD) (Warren-Averbach方法)和透射电子显微镜用于该目的。通过这两种技术,获得了晶粒直径(长度)的分布,从而可以比较两种结果。这些结果是通过考虑先前的粒度演化和微观结构演化的研究来解释的。对机械合金化过程中出现的晶粒细化和固溶体形成等现象有了更好的理解。两种方法得到的Cu-15at%Al体系的晶粒尺寸结果是一致的。该系统不存在粉末对研磨介质的粘附性。在Cu-20at%Ni的情况下,Cu和Ni体系呈现粘附性,结果仅在研磨864 k的粉末中一致。这是由于微观结构的均匀化,直到那个时候才达到。两类催化裂化体系的晶粒度随磨矿时间的变化趋势相反,称为黏附现象。例如,对于Cu-at15at%Al体系,在铣削180、360和864 ks时,70%的晶粒尺寸分别小于7.5、12和20 nm。在Cu-20at%Ni、Cu和Ni体系中,研磨时间分别为180、360和864 ks时,70%的晶粒尺寸分别小于35、22和16 nm。这些相反的趋势反映了不同的晶粒细化机制。在Cu-at15%Al和Cu-20%atNi体系中,形成固溶体所需的晶粒尺寸最大值为20 nm。
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