U. Heitmann, J. Bartsch, S. Kluska, Nima Huschmand, Jana Wulf, D. Lackner, F. Dimroth, S. Janz
{"title":"Challenges in the Fabrication of a Glued III-V on Si Tandem Solar Cell Using a ZnO-Based TCA","authors":"U. Heitmann, J. Bartsch, S. Kluska, Nima Huschmand, Jana Wulf, D. Lackner, F. Dimroth, S. Janz","doi":"10.1109/PVSC43889.2021.9518738","DOIUrl":null,"url":null,"abstract":"On the route to a high efficiency glued tandem solar cell fabricated using a ZnO-based transparent conductive adhesive, several challenges were encountered. By lowering the pressure during the annealing of the adhesive to 0.3 or 1 kg/cm2, the III-V surface did not crack and only minor delamination along the samples edge was observed. A fabricated tandem solar cell showed limitations due to voids within the bond (low fill factor) and a low current density due to a missing anti-reflective coating and reflectance at the bond layer. A sputtered TiO2:Nb contact layer showed a low ohmic contact on p-GaAs and thereby is suitable for implementation at the bond/III-V interface, which would significantly lower the reflectance at the bond.","PeriodicalId":6788,"journal":{"name":"2021 IEEE 48th Photovoltaic Specialists Conference (PVSC)","volume":"9 31","pages":"1121-1124"},"PeriodicalIF":0.0000,"publicationDate":"2021-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 48th Photovoltaic Specialists Conference (PVSC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PVSC43889.2021.9518738","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
On the route to a high efficiency glued tandem solar cell fabricated using a ZnO-based transparent conductive adhesive, several challenges were encountered. By lowering the pressure during the annealing of the adhesive to 0.3 or 1 kg/cm2, the III-V surface did not crack and only minor delamination along the samples edge was observed. A fabricated tandem solar cell showed limitations due to voids within the bond (low fill factor) and a low current density due to a missing anti-reflective coating and reflectance at the bond layer. A sputtered TiO2:Nb contact layer showed a low ohmic contact on p-GaAs and thereby is suitable for implementation at the bond/III-V interface, which would significantly lower the reflectance at the bond.