Curing and thermal comparative study of rosin epoxy thermosets with bio-based imidoamines and commercial curing agents

T. Thakur, B. Gaur
{"title":"Curing and thermal comparative study of rosin epoxy thermosets with bio-based imidoamines and commercial curing agents","authors":"T. Thakur, B. Gaur","doi":"10.1177/00952443221147034","DOIUrl":null,"url":null,"abstract":"This paper includes the curing of previously synthesized multifunctional bio-based epoxy resins (PEMPAE/TMPAE) with rosin-based imidoamine curing agents (IAMDK/IASDK/IAEDK) which are nucleophilic addition reaction products of diamino diphenyl ether (DDE) and dimaleopimaryl ketone (DMPK), a dehydrodecarboxylated derivative of MPA. Curing dynamics of rosin-based epoxy resins (PEMPAE/TMPAE) with rosin-based imidoamine curing agents (IAMDK/IASDK/IAEDK) were evaluated using differential scanning calorimetry. For comparison, the bio-based epoxy resins were also cured with rosin derivative dimaleopimaryl ketone (DMPK) and commercial-based diamino diphenyl ether (DDE). The universal testing machine and thermogravimetric analyzer) were used to measure the mechanical properties and thermal stability of the cured epoxy samples. The samples’ chemical resistance was assessed by calculating the weight loss in percent after they were submerged in solutions of NaOH, HCl, and NaCl. We also used scanning electron microscopy (SEM) to examine the morphological changes. Rosin-based epoxy cured with imidoamine curing agents outperformed the commercial epoxy in terms of performance.","PeriodicalId":15613,"journal":{"name":"Journal of Elastomers & Plastics","volume":"23 4","pages":"223 - 243"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Elastomers & Plastics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1177/00952443221147034","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

This paper includes the curing of previously synthesized multifunctional bio-based epoxy resins (PEMPAE/TMPAE) with rosin-based imidoamine curing agents (IAMDK/IASDK/IAEDK) which are nucleophilic addition reaction products of diamino diphenyl ether (DDE) and dimaleopimaryl ketone (DMPK), a dehydrodecarboxylated derivative of MPA. Curing dynamics of rosin-based epoxy resins (PEMPAE/TMPAE) with rosin-based imidoamine curing agents (IAMDK/IASDK/IAEDK) were evaluated using differential scanning calorimetry. For comparison, the bio-based epoxy resins were also cured with rosin derivative dimaleopimaryl ketone (DMPK) and commercial-based diamino diphenyl ether (DDE). The universal testing machine and thermogravimetric analyzer) were used to measure the mechanical properties and thermal stability of the cured epoxy samples. The samples’ chemical resistance was assessed by calculating the weight loss in percent after they were submerged in solutions of NaOH, HCl, and NaCl. We also used scanning electron microscopy (SEM) to examine the morphological changes. Rosin-based epoxy cured with imidoamine curing agents outperformed the commercial epoxy in terms of performance.
松香环氧热固性树脂与生物基咪胺和商用固化剂的固化和热对比研究
本文研究了用松香基咪胺固化剂(IAMDK/IASDK/IAEDK)固化先前合成的多功能生物基环氧树脂(PEMPAE/TMPAE)。IAMDK/IASDK/IAEDK是由二氨基二苯基醚(DDE)和二马来松烷基酮(DMPK) (MPA的脱氢脱羧衍生物)的亲核加成反应产物。采用差示扫描量热法研究了松香基环氧树脂(PEMPAE/TMPAE)与松香基咪胺固化剂(IAMDK/IASDK/IAEDK)的固化动力学。为了比较,还用松香衍生物二马来松基酮(DMPK)和商业基二氨基二苯醚(DDE)固化了生物基环氧树脂。采用万能试验机和热重分析仪对固化后的环氧树脂样品的力学性能和热稳定性进行了测试。通过计算样品在NaOH, HCl和NaCl溶液中浸泡后的重量损失百分比来评估样品的耐化学性。我们还使用扫描电子显微镜(SEM)检查了形态学变化。用咪胺固化剂固化的松香基环氧树脂在性能方面优于工业环氧树脂。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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