60 GHz AMC antennas in multi-processor multi-chip data transmission

Ho-Hsin Yeh, N. Hiramatsu, K. Melde
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Abstract

This paper mainly discusses the preliminary design of 60GHz antennas utilized in the multi-chip multi-core (MCMC) architecture. The antenna is designed with the low temperature co-fired ceramic (LTCC) fabrication process and the stacked via is selected as the vertical feeding. The designed antenna on the artificial magnetic conductor (AMC) demonstrates the high efficiency, impedance matching and enhanced end-fire radiation capabilities with the surface wave on the ground shielded conducting structures.
60ghz AMC天线在多处理器多芯片中的数据传输
本文主要讨论了多芯片多核(MCMC)架构中60GHz天线的初步设计。采用低温共烧陶瓷(LTCC)工艺设计天线,垂直馈电选择堆叠通孔。所设计的人造磁导体天线具有高效率、阻抗匹配性好、与地面屏蔽导体结构表面波的端射辐射能力增强等特点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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