Laboratory Characterization of Innovative 3D Trench-design Silicon Pixel Sensors Using a Sub-Picosecond Precision Laser-Based Testing Equipment

M. Aresti, A. Cardini, A. Lai, A. Loi, G. Cossu, M. Garau, A. Lampis, G. Betta, G. Forcolin
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引用次数: 3

Abstract

In the next generation of experiments at the future high luminosity particle colliders, the identification of the interaction and decay vertices will be an extremely difficult task because of the very large number of particles that will be produced at each bunch crossing. LHC experiments have shown that new vertex detectors with single-hit time resolutions of the order of 10 ps will allow to recover the current tracking and vertexing capabilities. The TimeSPOT project is developing 3D trench-based silicon pixel detectors with a time resolution below 30 ps. Initial beam test with a first sensors batch has showed that these detectors fulfill and even exceed these expectations. To carefully study their performances and optimize their design, it is important to precisely measure sensors time response over their active area. This paper summarize the preliminary measurements of this sensors developed within the TimeSPOT project performed in our laboratory, using a custom laser-based setup to deposit a known energy in specific regions of the pixel sensitive volume, allowing us to estimate the performances of these sensors under charge-particle illumination.
使用亚皮秒精度激光测试设备的创新3D沟槽设计硅像素传感器的实验室表征
在未来高亮度粒子对撞机的下一代实验中,相互作用和衰变顶点的识别将是一项极其困难的任务,因为在每个束交叉处将产生非常大量的粒子。大型强子对撞机的实验表明,单次命中时间分辨率为10ps的新顶点检测器将允许恢复当前的跟踪和顶点化能力。TimeSPOT项目正在开发基于3D沟槽的硅像素探测器,其时间分辨率低于30 ps。第一批传感器的初始光束测试表明,这些探测器达到甚至超过了预期。为了仔细研究其性能并优化其设计,精确测量传感器在其有源区域的时间响应是很重要的。本文总结了在我们实验室进行的TimeSPOT项目中开发的这种传感器的初步测量结果,使用定制的基于激光的设置将已知能量沉积在像素敏感体积的特定区域,使我们能够估计这些传感器在电荷粒子照明下的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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