Thermal Investigations on Modules Realized Using Solderless Assembly for Electronics Technology

Abstract

This work continues our investigation regarding the philosophy and the implementation of a new technology entitled Solderless Assembly for Electronics Technology (SAFE) or Occam [1]. Are presented the results of thermal analysis and measurements of electronic circuits, realized in Occam technology, compared to “classical” electronic modules realized on FR4. In the first case the convection from the top of component is blocked by the molding process. In the second case, free convection from top of component is considered. In both cases, the interconnection of components should be realized using printed conductive paste, as in the modified variant proposed in [1]. In this way, the heat generation in electronic components, in our case mid power LEDs, will be added with the supplemental dissipation caused by the current flow. For comparison purposes, there were investigated structures containing fixed linear resistors and/or structures printed on flat substrates.