{"title":"Energy Efficient and Low dynamic power Consumption TCAM on FPGA","authors":"Sridhar Raj, Sankara Vadivel, Shantha Selva Kumari Ramapackiam","doi":"10.33180/infmidem2022.304","DOIUrl":null,"url":null,"abstract":": Ternary Content Addressable Memories [TCAM] based on Field Programmable Gate Arrays [FPGA] are widely used in artificial intelligence [AI] and networking applications. TCAM macros are unavailable within the FPGA; therefore, they must be emulated using SRAM-based memories, which require FPGA resources. Compared to state-of-the-art designs, the proposed FPGA-based TCAM implementation will save significant resources. This methodology makes use of the Lookup Table RAMS (LUTRAMs), slice carry-chains, and flip-flops (FF) allowing simultaneous mapping of rules and deeper pipelining respectively. The TCAM implementation results in lower power consumption, fewer delays and lower resource utilization. It outperforms conventional FPGA-based TCAMs in terms of energy efficiency (EE) and performance per area (PA) by at least 3.34 and 8.4 times respectively, and 56% better than existing FPGA designs. The proposed method outperforms all previous approaches due to its low dynamic power consumption when considering the huge size of TCAM emulation on SRAM-based FPGAs.","PeriodicalId":56293,"journal":{"name":"Informacije Midem-Journal of Microelectronics Electronic Components and Materials","volume":"64 1","pages":""},"PeriodicalIF":0.6000,"publicationDate":"2022-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Informacije Midem-Journal of Microelectronics Electronic Components and Materials","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.33180/infmidem2022.304","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
: Ternary Content Addressable Memories [TCAM] based on Field Programmable Gate Arrays [FPGA] are widely used in artificial intelligence [AI] and networking applications. TCAM macros are unavailable within the FPGA; therefore, they must be emulated using SRAM-based memories, which require FPGA resources. Compared to state-of-the-art designs, the proposed FPGA-based TCAM implementation will save significant resources. This methodology makes use of the Lookup Table RAMS (LUTRAMs), slice carry-chains, and flip-flops (FF) allowing simultaneous mapping of rules and deeper pipelining respectively. The TCAM implementation results in lower power consumption, fewer delays and lower resource utilization. It outperforms conventional FPGA-based TCAMs in terms of energy efficiency (EE) and performance per area (PA) by at least 3.34 and 8.4 times respectively, and 56% better than existing FPGA designs. The proposed method outperforms all previous approaches due to its low dynamic power consumption when considering the huge size of TCAM emulation on SRAM-based FPGAs.
期刊介绍:
Informacije MIDEM publishes original research papers in the fields of microelectronics, electronic components and materials. Review papers are published upon invitation only. Scientific novelty and potential interest for a wider spectrum of readers is desired. Authors are encouraged to provide as much detail as possible for others to be able to replicate their results. Therefore, there is no page limit, provided that the text is concise and comprehensive, and any data that does not fit within a classical manuscript can be added as supplementary material.
Topics of interest include:
Microelectronics,
Semiconductor devices,
Nanotechnology,
Electronic circuits and devices,
Electronic sensors and actuators,
Microelectromechanical systems (MEMS),
Medical electronics,
Bioelectronics,
Power electronics,
Embedded system electronics,
System control electronics,
Signal processing,
Microwave and millimetre-wave techniques,
Wireless and optical communications,
Antenna technology,
Optoelectronics,
Photovoltaics,
Ceramic materials for electronic devices,
Thick and thin film materials for electronic devices.