Optimization of platinum thin film as a bottom electrode for aluminum nitride thin films using Plackett-Burman statistical approach

Abstract

In this work, Plackett-Burman design is used to optimize platinum thin film sputtering parameters. The effect of different deposition parameters on Pt (111) rocking curve FWHM, residual stress and roughness of Pt film was studied. These substrate parameters are known to influence the quality of AlN deposited on it. It was concluded that most critical parameters deciding platinum film quality are power, annealing temperature, and deposition pressure. By identifying the most critical parameters, we narrowed our subsequent two-level factorial optimization domain by a factor of 16. Furthermore, based on the Plackett-Burman screening, the optimal values of non-critical process parameters can be set by a judicious choice that would yield best results for one of the features of film quality without adversely affecting the other features.