Impurity-impurity interaction during the growth of UMG-Si-based mc-Si

R. V. Presnyakov, S. M. Peshcherova, A. G. Chueshova, V. Bychinskii, A. Nepomnyashchikh
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Abstract

This article investigates the relationship between the chemical composition and electrophysical properties of p- and n-type multicrystalline silicon ingots based on metallurgical silicon with a purity of 99.99 at.%. In particular, the role of impurity-impurity interactions in the production of multisilicon by the Bridgman vertical method is evaluated in order to identify approaches to controlling this process effectively. The phase equilibrium calculations in the “silicon–all impurities” and “silicon-impurity-oxygen” systems were carried out based on the Gibbs energy minimization in the Selector software package. The study investigates the rank correlations of the concentrations of various impurities with each other, as well as with the specified electrical resistivity (SER) and the lifetime of nonequilibrium charge carriers (NCC) in the direction of crystal growth. Pair correlations of the element distribution profiles were considered based on the role of the main factor represented by the ratio of individual impurity solubilities in solid or liquid silicon (k0), as well as from the standpoint of direct interaction between two elements. It was found that the k0 value for two individual impurities in silicon does not automatically lead to the pair correlation of their distribution profiles in the ingot. A significant effect on the distribution profiles of impurities in multisilicon with k0→0 has the factor of binding some part of the impurity into such a form that this impurity can be incorporated easily into a growing crystal. Binding may be induced by the interaction of the impurity in the melt with the oxygen background, its segregation at the grain boundaries, and its capture by the crystallization front in the composition of the liquid inclusion. Significant correlations of impurity distribution profiles in the ingot were demonstrated by the pairs whose elements interact without the formation of chemical compounds in the 25–1413 °C temperature range. The conducted phase equilibrium calculations for the “silicon–all impurities” system revealed the possibility of forming the VB2, TiB2, ZrB2, and MgTiO4 solid phases in the melt.
umg - si基mc-Si生长过程中杂质-杂质相互作用
本文研究了纯度为99.99 at.%的冶金硅制备的p型和n型多晶硅锭的化学成分与电物理性能的关系。特别是,杂质-杂质相互作用的作用,在生产多晶硅的布里奇曼垂直方法进行了评估,以确定有效控制这一过程的方法。基于选择器软件包中的吉布斯能量最小化,进行了“全硅-杂质”和“硅-杂质-氧”体系的相平衡计算。研究了各种杂质浓度之间的等级相关性,以及与晶体生长方向上的规定电阻率(SER)和非平衡载流子(NCC)寿命的等级相关性。基于单个杂质在固硅或液态硅中的溶解度比(k0)所代表的主要因素的作用,以及两种元素之间直接相互作用的观点,考虑了元素分布曲线的对相关性。结果表明,硅中两种杂质的k0值并不会自动导致其在钢锭中的分布对相关性。当k0→0时,对多晶硅中杂质分布的显著影响是将杂质的某些部分结合成这样一种形式,使得该杂质可以很容易地结合到生长的晶体中。熔体中的杂质与氧背景的相互作用、其在晶界的偏析以及其在液体包裹体组成中的结晶锋的捕获可引起结合。在25-1413°C温度范围内,其元素相互作用而不形成化合物的对证明了铸锭中杂质分布曲线的显著相关性。对“全硅杂质”体系进行了相平衡计算,揭示了熔体中形成VB2、TiB2、ZrB2和MgTiO4固相的可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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