Non-silicon applications of direct bonding

Jan Haisma, Jan J.C. Groenen, Peter W. de Haas
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引用次数: 4

Abstract

Four examples of direct bonding in non-silicon applications will be considered. Fusing, locally by laser scribing or integrally by annealing, gives an increased bond strength, since a chemical reaction or interdiffusion process takes place at the interface. Direct bonding of magnetic materials is a special case due to the contribution of magnetic forces to the bond strength. This process has been used to design an optimized axial-field motor. Direct bonding of an optical-fibre plate and a fluorescent-garnet substrate makes it possible to achieve an electron-microscopic detector with a high resolving power. A polymer direct-bonded to a superfinish-polished metal can be used in an x-ray reflector as a surface-protective element.

直接键合的非硅应用
将考虑在非硅应用中直接键合的四个例子。由于在界面处发生了化学反应或相互扩散过程,通过局部激光划痕或整体退火熔接都能提高粘合强度。磁性材料的直接键合是一种特殊情况,因为磁力对键合强度有贡献。该方法已用于设计优化的轴向磁场电机。将光纤板与荧光石榴石衬底直接结合,可以实现具有高分辨率的电子显微镜探测器。直接与超抛光金属结合的聚合物可以用作x射线反射器的表面保护元件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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