Jianhua Wang, Hua Tong, Jing C Mao, Dan Zhou, Jihu M. Peng
{"title":"Surface Micromachining Techniques in InP Based Micro-Opto-Electro-Mechanical System","authors":"Jianhua Wang, Hua Tong, Jing C Mao, Dan Zhou, Jihu M. Peng","doi":"10.1080/10587250108024788","DOIUrl":null,"url":null,"abstract":"Abstract Several Indium Phosphide based surface micromachining processes are presented in this paper, in order to develop Micro-Opto-Electro-Mechanical systems. By fabricating micro °Cantilevers composed of InP/Air gap pairs, the major techniques of the surface micromachining are studied, including non-selective and selective etching, rinsing and drying and so on. A severe problem of the sticking phenomena during the rinsing and drying is avoided by implementation of the Critical Point Drying (CPD) method.","PeriodicalId":18940,"journal":{"name":"Molecular Crystals and Liquid Crystals Science and Technology. Section A. Molecular Crystals and Liquid Crystals","volume":"45 1","pages":"481 - 484"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Molecular Crystals and Liquid Crystals Science and Technology. Section A. Molecular Crystals and Liquid Crystals","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/10587250108024788","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Abstract Several Indium Phosphide based surface micromachining processes are presented in this paper, in order to develop Micro-Opto-Electro-Mechanical systems. By fabricating micro °Cantilevers composed of InP/Air gap pairs, the major techniques of the surface micromachining are studied, including non-selective and selective etching, rinsing and drying and so on. A severe problem of the sticking phenomena during the rinsing and drying is avoided by implementation of the Critical Point Drying (CPD) method.