Fast and optimized task allocation method for low vertical link density 3-Dimensional Networks-on-Chip based many core systems

Haoyuan Ying, T. Hollstein, K. Hofmann
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引用次数: 6

Abstract

The advantages of moving from 2-Dimensional Networks-on-Chip (NoCs) to 3-Dimensional NoCs for any application must be justified by the improvements in performance, power, latency and the overall system costs, especially the cost of Through-Silicon-Via (TSV). The trade-off between the number of TSVs and the 3D NoCs system performance becomes one of the most critical design issues. In this paper, we present a fast and optimized task allocation method for low vertical link density (TSV number) 3D NoCs based many core systems, in comparison to the classic methods as Genetic Algorithm (GA) and Simulated Annealing (SA), our method can save quite a number of design time. We take several state-of-the-art benchmarks and the generic scalable pseudo application (GSPA) with different network scales to simulate the achieved design (by our method), in comparison to GA and SA methods achieved designs, our technique can achieve better performance and lower cost. All the experiments have been done in GSNOC framework (written in SystemC-RTL), which can achieve the cycle accuracy and good flexibility.
低垂直链路密度三维片上网络多核心系统的快速优化任务分配方法
对于任何应用程序来说,从二维片上网络(noc)迁移到三维noc的优势必须通过性能、功耗、延迟和整体系统成本的改进来证明,特别是通硅通孔(TSV)的成本。tsv数量与3D noc系统性能之间的权衡成为最关键的设计问题之一。本文提出了一种基于多核心系统的低垂直链路密度(TSV数)3D noc的快速优化任务分配方法,与遗传算法(GA)和模拟退火(SA)等经典方法相比,该方法可以节省大量的设计时间。我们采用几种最先进的基准测试和具有不同网络规模的通用可扩展伪应用程序(GSPA)来模拟实现的设计(通过我们的方法),与GA和SA方法实现的设计相比,我们的技术可以实现更好的性能和更低的成本。所有实验均在GSNOC框架(用SystemC-RTL编写)中完成,可以达到周期精度和良好的灵活性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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