M. Nowlan, S. Hogan, G. Darkazalli, S. Sutherland, W. Breen, J. Murach, J. Patterson
{"title":"Advanced automation techniques for interconnecting thin silicon solar cells","authors":"M. Nowlan, S. Hogan, G. Darkazalli, S. Sutherland, W. Breen, J. Murach, J. Patterson","doi":"10.1109/WCPEC.1994.520088","DOIUrl":null,"url":null,"abstract":"The objective of this work is to reduce the cost and improve the quality of terrestrial photovoltaic modules by developing automated high-throughput (5 MW/yr) processes for interconnecting thin silicon solar cells. New low-stress, high-throughput processes have been developed for cell loading, alignment, and inspection, interconnect ribbon handling, flux application, ribbon-to-cell soldering, cell string handling, and I-V testing of assembled cell strings. Both standard thickness (350 /spl mu/m) and thin (200 /spl mu/m) cells have been used to evaluate and refine these processes.","PeriodicalId":20517,"journal":{"name":"Proceedings of 1994 IEEE 1st World Conference on Photovoltaic Energy Conversion - WCPEC (A Joint Conference of PVSC, PVSEC and PSEC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1994-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 IEEE 1st World Conference on Photovoltaic Energy Conversion - WCPEC (A Joint Conference of PVSC, PVSEC and PSEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WCPEC.1994.520088","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
The objective of this work is to reduce the cost and improve the quality of terrestrial photovoltaic modules by developing automated high-throughput (5 MW/yr) processes for interconnecting thin silicon solar cells. New low-stress, high-throughput processes have been developed for cell loading, alignment, and inspection, interconnect ribbon handling, flux application, ribbon-to-cell soldering, cell string handling, and I-V testing of assembled cell strings. Both standard thickness (350 /spl mu/m) and thin (200 /spl mu/m) cells have been used to evaluate and refine these processes.