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A Study on Contact Thermal Resistance of a Mold Heating Assembly Using Finite Element Analysis and Infrared Image

IF 0.2 Q4 ENGINEERING, MECHANICAL
Transactions of the Korean Society of Mechanical Engineers B Pub Date : 2022-08-31 DOI:10.3795/ksme-b.2022.46.8.453
B. Seo, Changmin Park
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基于有限元分析和红外图像的模具加热组件接触热阻研究
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来源期刊
Transactions of the Korean Society of Mechanical Engineers B
Transactions of the Korean Society of Mechanical Engineers B ENGINEERING, MECHANICAL-
CiteScore
0.30
自引率
50.00%
发文量
61
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